18539949. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Pyoungwan Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18539949 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first wiring structure, a second wiring structure, a semiconductor chip, and an expanded structure that connects the wiring structures and surrounds the chip.
- The first and second wiring structures may have insulating layers, wiring layers, crack prevention layers, and wiring pads.
- The expanded structure provides electrical connection and protection for the semiconductor chip.
- The crack prevention layer helps to prevent damage to the wiring layers.
- The second wiring layer includes a pad portion for additional connectivity.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a reliable and efficient way to connect and protect semiconductor chips in electronic devices. - Helps prevent cracks and damage to the wiring structures, improving overall durability.
Benefits: - Enhanced reliability and performance of electronic devices. - Improved protection for semiconductor chips, leading to longer lifespan of the devices.
Commercial Applications: Title: Semiconductor Package Technology for Enhanced Device Reliability This technology can be utilized by semiconductor manufacturers, electronics companies, and device manufacturers to improve the quality and durability of their products. It can lead to increased customer satisfaction and brand loyalty in the market.
Prior Art: Readers can explore prior patents related to semiconductor packaging, wiring structures, and crack prevention techniques to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Stay updated on the latest developments in semiconductor packaging, wiring technologies, and crack prevention methods to ensure the continued improvement and innovation in electronic device manufacturing.
Questions about Semiconductor Package Technology: 1. How does the expanded structure in the semiconductor package contribute to the overall reliability of the device? 2. What are the key differences between the first and second wiring structures in terms of functionality and design?
Original Abstract Submitted
A semiconductor package may include a first wiring structure, a second wiring structure on the first wiring structure, a semiconductor chip between the first wiring structure and the second wiring structure, and an expanded structure that electrically connects the first wiring structure with the second wiring structure and surrounds the semiconductor chip. At least one of the first wiring structure and the second wiring structure may include a first insulating layer on the semiconductor chip and the expanded structure, a first wiring layer on the first insulating layer, a second insulating layer covering the first insulating layer and the first wiring layer, a crack prevention layer on the second insulating layer, and a second wiring layer on the second insulating layer and the crack prevention layer. The second wiring layer may include a pad portion.
