18538670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Moon Soo Park of Suwon-si (KR)
Seung Hyun Noh of Suwon-si (KR)
Moon Kyung Hwang of Suwon-si (KR)
Chung Hwan Kim of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18538670 titled 'MULTILAYER ELECTRONIC COMPONENT
The multilayer electronic component described in the patent application includes a capacitance formation portion where the first and second internal electrodes overlap in a first direction, as well as a first margin portion on one side surface or the other side surface of the capacitance formation portion in a second direction, including one end of the first or second internal electrode. The dielectric layer consists of a first region at the center region of the dielectric layer within the capacitance formation portion, and a second region within the first margin portion. The second region contains at least one element of Mg, Si, Al, Li, Cu, Na, Bi, Mn, Cr, V, Fe, Ni, Co, Sn, In, Ga, Zn, Pb, Ag, Pd, Pt, Ir, Ru, Os, Y, Er, Yb, Tb, Ho, Dy, which is not substantially included in the first region.
- Overlapping first and second internal electrodes in a capacitance formation portion
- Inclusion of a first margin portion containing one end of the internal electrodes
- Dielectric layer with distinct regions for different elements
- Presence of specific elements in the second region of the dielectric layer
- Exclusion of these elements from the first region
- Potential Applications:**
- Consumer electronics - Telecommunications equipment - Automotive electronics - Industrial machinery - Medical devices
- Problems Solved:**
- Improved capacitance formation in electronic components - Enhanced performance and reliability of multilayer electronic devices - Better integration of internal electrodes and dielectric layers
- Benefits:**
- Higher efficiency in electronic circuits - Increased durability and longevity of electronic components - Enhanced overall performance of electronic devices
- Commercial Applications:**
The technology described in the patent application could be utilized in various industries such as consumer electronics, telecommunications, automotive, industrial manufacturing, and medical equipment. Companies involved in the production of electronic components could benefit from incorporating this innovation into their products to improve performance and reliability.
- Questions about the Technology:**
1. How does the inclusion of specific elements in the second region of the dielectric layer impact the overall performance of the electronic component? 2. What are the potential challenges in manufacturing multilayer electronic components with overlapping internal electrodes and distinct dielectric regions?
Original Abstract Submitted
A multilayer electronic component includes a capacitance formation portion where the first and second internal electrodes overlap each other in a first direction, a first margin portion disposed on one side surface or the other side surface of the capacitance formation portion in a second direction and including one end of the first or second internal electrode. A dielectric layer includes a first region disposed at a center region of the dielectric layer included in the capacitance formation portion, and a second region included in the first margin portion. At least one element of Mg, Si, Al, Li, Cu, Na, Bi, Mn, Cr, V, Fe, Ni, Co, Sn, In, Ga, Zn, Pb, Ag, Pd, Pt, Ir, Ru, Os, Y, Er, Yb, Tb, Ho, Dy is included in the second region, and not substantially included in the first region.
