18538117. FORMING METHOD, FORMING APPARATUS, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
FORMING METHOD, FORMING APPARATUS, AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
TADASHI Hattori of Tochigi (JP)
FORMING METHOD, FORMING APPARATUS, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18538117 titled 'FORMING METHOD, FORMING APPARATUS, AND ARTICLE MANUFACTURING METHOD
The present invention involves a method for forming a composition on a substrate using a mold, which includes detecting the state of the underlying film on the substrate by analyzing reflected light, determining measurement conditions based on this analysis, bringing the mold and composition into contact, and measuring the position of a mark on the substrate after contact is made.
- Detection of underlying film state using reflected light
- Determination of measurement conditions based on detected index
- Contact between mold and composition on substrate
- Measurement of mark position after contact is made
- Analysis performed before contact is established
- Potential Applications:**
This technology can be used in industries such as semiconductor manufacturing, microelectronics, and nanotechnology for precise patterning and alignment processes.
- Problems Solved:**
This method addresses the challenge of accurately forming compositions on substrates by providing a reliable way to measure and align the position of marks.
- Benefits:**
- Improved accuracy in forming compositions on substrates - Enhanced efficiency in manufacturing processes - Reduction of errors and waste in production
- Commercial Applications:**
Title: Precision Patterning Technology for Semiconductor Manufacturing This technology can be utilized in the production of microchips, sensors, and other electronic components where precise patterning and alignment are crucial for performance and functionality.
- Questions about the Technology:**
1. How does this method improve the accuracy of forming compositions on substrates? 2. What are the potential applications of this technology in the semiconductor industry?
- Frequently Updated Research:**
Researchers are continually exploring new materials and methods to enhance the precision and efficiency of forming compositions on substrates in various industries. Stay updated on the latest advancements in this field for potential improvements in manufacturing processes.
Original Abstract Submitted
The present invention provides a forming method of forming a composition on an underlying film of a substrate by using a mold, the method including: detecting, as an index indicating a state of the underlying film, at least one of an intensity and a wavelength of reflected light obtained from the substrate by irradiating the substrate with light; determining, based on the detected index, a measurement condition for measuring a position of a mark of the substrate; bringing the mold and the composition on the substrate into contact with each other; and measuring, after the bringing, in a contact state in which the mold and the composition are in contact with each other, the position of the mark of the substrate under the determined measurement condition, wherein the detecting is performed before the bringing.
