18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18537997 titled 'SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD
The abstract of the patent application describes a semiconductor chip with a semiconductor substrate that has an active surface and an inactive surface. A semiconductor device layer is on the active surface, and a modified region covers the entire lateral side surface of the substrate.
- The semiconductor chip includes a semiconductor substrate with active and inactive surfaces.
- A semiconductor device layer is positioned on the active surface of the substrate.
- A modified region covers the entirety of the lateral side surface of the semiconductor substrate.
Potential Applications: - This technology could be used in the development of advanced semiconductor devices. - It may find applications in the manufacturing of high-performance electronic components.
Problems Solved: - Enhances the performance and functionality of semiconductor chips. - Provides improved protection and stability to the semiconductor substrate.
Benefits: - Increased efficiency and reliability of semiconductor devices. - Enhanced durability and longevity of the semiconductor chip.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Performance This technology could be utilized in the production of cutting-edge electronic devices, leading to improved performance and reliability in various industries such as telecommunications, computing, and consumer electronics.
Questions about Semiconductor Chip Technology: 1. How does the modified region on the lateral side surface of the semiconductor substrate contribute to the overall functionality of the chip?
The modified region enhances the protection and stability of the semiconductor substrate, improving the performance and longevity of the chip.
2. What potential applications could this advanced semiconductor chip technology have in the consumer electronics market?
This technology could be used to develop more efficient and reliable electronic devices for consumers, leading to enhanced user experiences and product performance.
Original Abstract Submitted
A semiconductor chip includes a semiconductor substrate having an active surface and an inactive surface opposite the active surface. A semiconductor device layer is disposed on the active surface. A modified region is positioned on an entirety of a lateral side surface of the semiconductor substrate.
