18537324. INSULATION MODULE simplified abstract (Rohm Co., Ltd.)
Contents
- 1 INSULATION MODULE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INSULATION MODULE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INSULATION MODULE
Organization Name
Inventor(s)
Masahiko Arimura of Kyoto-shi (JP)
Tomoichiro Toyama of Kyoto-shi (JP)
INSULATION MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18537324 titled 'INSULATION MODULE
Simplified Explanation
The insulation module described in the patent application includes a light-emitting element with a pad on its surface, a light-receiving element forming a photocoupler with the light-emitting element, a plate-shaped member between the light-emitting and light-receiving surfaces, and a wire connected to the pad. The pad is positioned off-center towards a section of the light-emitting surface where the distance to the plate-shaped member increases.
- Light-emitting element with pad on surface
- Light-receiving element forming a photocoupler
- Plate-shaped member with light-transmitting and insulating properties
- Wire connected to the pad
Potential Applications
This technology could be used in:
- Optoelectronic devices
- Communication systems
- Sensor applications
Problems Solved
This innovation addresses:
- Improved light transmission
- Enhanced insulation properties
- Efficient signal transfer
Benefits
The benefits of this technology include:
- Increased efficiency in light transmission
- Enhanced signal reliability
- Improved insulation properties
Potential Commercial Applications
This technology could be applied in:
- LED lighting systems
- Fiber optic communication devices
- Industrial automation equipment
Possible Prior Art
One possible prior art for this technology could be the use of similar insulation modules in optoelectronic devices or communication systems.
Unanswered Questions
How does the inclination of the plate-shaped member impact the performance of the insulation module?
The angle of inclination of the plate-shaped member could affect the efficiency of light transmission and signal transfer within the module.
What materials are commonly used for the plate-shaped member in similar insulation modules?
The choice of materials for the plate-shaped member could influence the overall performance and durability of the insulation module.
Original Abstract Submitted
This insulation module comprises: a light-emitting element that has a light-emitting surface and a pad formed on the light-emitting surface; a light-receiving element that has a light-receiving surface facing the light-emitting surface with a space therebetween, and that constitutes a photocoupler together with the light-emitting element; a plate-shaped member that is provided between the light-emitting surface and the light-receiving surface, has light-transmitting and insulating properties, and is inclined with respect to both the light-emitting surface and the light-receiving surface; and a wire that is connected to the pad. The pad is disposed offset from the center toward a section among the light-emitting surface where the distance to the plate-shaped member increases.
