18536945. METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT simplified abstract (NICHIA CORPORATION)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
Organization Name
Inventor(s)
Hirofumi Kawaguchi of Tokushima-shi (JP)
Takehiro Ishitani of Komatsushima-shi (JP)
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18536945 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
Simplified Explanation:
The patent application describes a method of manufacturing a semiconductor element that involves a semiconductor structure, a resin member, and a first insulation film.
Key Features and Innovation:
- Provides a structure including a semiconductor structure, a resin member, and a first insulation film.
- Offers a method for manufacturing a semiconductor element.
- Combines different components to create a semiconductor element.
Potential Applications:
This technology could be used in the manufacturing of various semiconductor devices such as integrated circuits, transistors, and diodes.
Problems Solved:
This technology addresses the need for a method of manufacturing semiconductor elements efficiently and effectively.
Benefits:
- Improved manufacturing process for semiconductor elements.
- Enhanced performance and reliability of semiconductor devices.
- Cost-effective production of semiconductor components.
Commercial Applications:
The technology could have commercial applications in the semiconductor industry, leading to the production of high-quality and reliable semiconductor devices.
Questions about Semiconductor Element Manufacturing: 1. What are the key components involved in manufacturing a semiconductor element?
- The key components include a semiconductor structure, a resin member, and a first insulation film.
2. How does this method of manufacturing semiconductor elements differ from traditional methods?
- This method offers a structured approach that combines different elements to create a semiconductor element.
Original Abstract Submitted
A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film;
