18536789. FILM FORMING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
FILM FORMING APPARATUS
Organization Name
Inventor(s)
Noriaki Fukiage of Yamanashi (JP)
Hiroyuki Wada of Yamanashi (JP)
FILM FORMING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18536789 titled 'FILM FORMING APPARATUS
Simplified Explanation: The patent application describes a film forming apparatus with a processing chamber and a substrate support that has a recess for holding a substrate. The recess includes a projection at the bottom surface, along the outer periphery of the substrate.
- The film forming apparatus includes a processing chamber and a substrate support.
- The substrate support has a recess where the substrate is placed.
- A projection is present at the bottom surface of the recess, along the outer edge of the substrate.
Potential Applications: 1. Semiconductor manufacturing 2. Thin film deposition processes 3. Solar cell production
Problems Solved: 1. Ensures uniform film deposition on the substrate. 2. Prevents edge effects during film formation. 3. Improves overall film quality and consistency.
Benefits: 1. Enhanced film uniformity 2. Reduced edge defects 3. Improved production efficiency
Commercial Applications: Title: Advanced Film Forming Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance film deposition processes, leading to higher quality semiconductor devices. The market implications include improved product performance and reliability, ultimately benefiting consumers and manufacturers.
Questions about Film Forming Apparatus: 1. How does the presence of a projection in the recess improve film formation?
- The projection helps in maintaining uniform film thickness across the substrate, reducing edge effects.
2. What are the key advantages of using this film forming apparatus in semiconductor manufacturing?
- The apparatus ensures consistent film quality, reducing defects and improving overall production efficiency.
Original Abstract Submitted
A film forming apparatus includes a processing chamber and a substrate support provided in the processing chamber. The substrate support includes a recess in which a substrate is placed. The recess includes a projection at a bottom surface thereof. The projection is provided along an outer periphery of the substrate placed in the recess.
