18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18536332 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the abstract consists of a first structure with a first semiconductor chip and a second structure on top of it, containing a second semiconductor chip, a semiconductor pattern, an insulating pattern, and through-electrode structures.
- The first structure includes a first semiconductor chip with a semiconductor integrated circuit.
- The second structure includes a second semiconductor chip with a semiconductor integrated circuit, a semiconductor pattern, and an insulating pattern.
- Through-electrode structures penetrate through the second semiconductor chip or the semiconductor pattern.
- The semiconductor pattern is horizontally spaced apart from the second semiconductor chip and has two side surfaces.
- One side of the semiconductor pattern faces the second semiconductor chip, while the other side is aligned with a side surface of the first semiconductor chip.
Potential Applications: - Advanced semiconductor packaging technology for improved performance and functionality in electronic devices. - Enhanced integration of multiple semiconductor chips in a compact package. - Increased efficiency and reliability in semiconductor devices.
Problems Solved: - Overcoming limitations in traditional semiconductor packaging methods. - Facilitating better communication and data transfer between semiconductor chips. - Enhancing overall performance and functionality of electronic devices.
Benefits: - Improved overall performance and functionality of electronic devices. - Enhanced efficiency and reliability in semiconductor packaging. - Increased integration capabilities for complex electronic systems.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be applied in various industries such as consumer electronics, telecommunications, automotive, and medical devices. It can revolutionize the design and functionality of electronic devices, leading to more advanced and efficient products in the market.
Questions about the technology: 1. How does this semiconductor packaging technology compare to traditional methods? - This technology offers improved integration and communication between semiconductor chips, leading to enhanced performance and functionality in electronic devices. 2. What are the potential challenges in implementing this advanced packaging technology? - Some challenges may include optimizing the manufacturing process, ensuring compatibility with existing systems, and managing thermal considerations effectively.
Original Abstract Submitted
A semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. The second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a semiconductor pattern horizontally spaced apart from the second semiconductor chip and on a side surface of the second semiconductor chip, an insulating pattern between the second semiconductor chip and the semiconductor pattern, and through-electrode structures. At least one of the through-electrode structures penetrates through at least a portion of the second semiconductor chip or penetrates through the semiconductor pattern. The semiconductor pattern has a first side surface facing the side surface of the second semiconductor chip and a second side surface opposing the first side surface. The second side surface of the semiconductor pattern is vertically aligned with a side surface of the first semiconductor chip.
