18535339. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Joonghyun Baek of Suwon-si (KR)
Cheol-Woo Lee of Suwon-si (KR)
Sunghwan Yoon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18535339 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes two chip stacks with semiconductor chips having an offset stack structure, as well as buffer chips and connection substrates on a substrate, all covered by mold layers.
- The semiconductor package features first and second chip stacks with offset stack structures.
- Buffer chips are positioned on the substrate at the sides of each chip stack.
- Connection substrates are present on both chip stacks for interconnection purposes.
- Mold layers cover the substrate, chip stacks, and connection substrates.
- Additional chip stacks with offset stack structures are placed on top of the first mold layer, covered by a second mold layer.
Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices. - It may find applications in the development of high-performance electronic systems.
Problems Solved: - Provides a solution for integrating multiple chip stacks with offset structures in a compact package. - Enables efficient interconnection between different chip stacks on a single substrate.
Benefits: - Improved performance and functionality of semiconductor devices. - Enhanced reliability and durability of electronic systems. - Cost-effective packaging solution for complex semiconductor components.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics This technology could be utilized in the production of smartphones, tablets, computers, and other consumer electronics requiring compact and efficient semiconductor packaging solutions.
Questions about the technology: 1. How does the offset stack structure in the chip stacks contribute to the overall performance of the semiconductor package? 2. What are the potential challenges in scaling up this packaging technology for mass production?
Original Abstract Submitted
A semiconductor package including first and second chip stacks each including semiconductor chips having an offset stack structure, the second chip stack horizontally spaced apart from the first chip stack, a first buffer chip on the substrate and at a side of the first chip stack, a second buffer chip on the substrate and at a side of the second chip stack, a connection substrate on the first and second chip stacks, a first mold layer covering the substrate, the first chip stack, and the second stack and exposing a top surface of the connection substrate, third and fourth chip stacks each including semiconductor chips having an offset stack structure on the first mold layer and, the fourth chip stack horizontally spaced apart from the third chip stack, and a second mold layer covering the first mold layer, the third chip stack, and the fourth chip stack may be provided.
