18535231. SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN
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SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN - A simplified explanation of the abstract
This abstract first appeared for US patent application 18535231 titled 'SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN
The semiconductor package described in the abstract includes a substrate with an upper pad, an alignment pad, and a first bonding pad with a trench. A semiconductor chip is connected to the first bonding pad with a bonding wire that fills the trench partially.
- Substrate with upper pad, alignment pad, and first bonding pad with trench
- Semiconductor chip connected to first bonding pad with bonding wire
- Trench in first bonding pad filled partially by bonding wire
- Alignment pattern aligned with trench for precise connection
- Innovative design for efficient semiconductor packaging
Potential Applications: - Semiconductor industry for packaging chips - Electronics manufacturing for compact devices - Automotive industry for advanced sensors
Problems Solved: - Precise alignment of bonding wire with bonding pad - Efficient use of space in semiconductor packaging
Benefits: - Improved connection reliability - Space-saving design for compact devices - Enhanced performance in semiconductor applications
Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in various industries such as electronics manufacturing, automotive, and semiconductor production. It offers a more efficient and reliable way to package semiconductor chips, leading to improved performance in electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the alignment pattern ensure precise connection in the semiconductor package? 2. What are the potential benefits of using this innovative semiconductor packaging technology?
Original Abstract Submitted
A semiconductor package includes a substrate including an upper pad and an alignment pad on an upper surface thereof, a first bonding pad disposed on the upper pad, the first bonding pad including a first trench extending in one direction on an upper surface thereof, at least one first alignment pattern disposed on the alignment pad and disposed to be adjacent to the first bonding pad, a semiconductor chip disposed on the substrate, and a first bonding wire connecting the semiconductor chip to the first bonding pad, wherein the at least one first alignment pattern is aligned with the first trench in a direction in which the first trench extends, and the first bonding wire contacts the first bonding pad and partially fills an inner wall of the first trench.
