18535137. IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
Keisuke Kimura of Tochigi (JP)
IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18535137 titled 'IMPRINT APPARATUS, IMPRINT METHOD AND ARTICLE MANUFACTURING METHOD
The abstract describes an imprint apparatus that includes a mold holding unit, an adjusting unit, and a control unit to control the imprint process. The apparatus is used to separate a mold from a pattern made of a cured product of an imprint material on a substrate by adjusting the pressure difference between the surfaces.
- Mold holding unit holds the mold
- Adjusting unit adjusts pressure difference between surfaces
- Control unit controls the imprint process, including the separation process
- Separation process involves separating the mold from the pattern on the substrate
- Pressure difference is adjusted so that the first pressure is smaller than the second pressure
Potential Applications: - Semiconductor manufacturing - Nanotechnology - Optics and photonics
Problems Solved: - Precise separation of mold from substrate - Control of pressure difference during imprint process
Benefits: - Improved accuracy in pattern transfer - Enhanced efficiency in manufacturing processes - Consistent results in imprinting technology
Commercial Applications: Title: Advanced Imprint Apparatus for Precision Manufacturing This technology can be used in industries such as semiconductor fabrication, nanotechnology research, and optical component manufacturing. It offers a high level of control and precision in pattern transfer processes, leading to improved product quality and efficiency in production.
Questions about Imprint Apparatus: 1. How does the adjusting unit control the pressure difference between surfaces? The adjusting unit uses a mechanism to regulate the pressure in the first space between the substrate and the mold surface. 2. What are the key advantages of using this imprint apparatus in semiconductor manufacturing? This imprint apparatus offers improved accuracy and efficiency in transferring patterns onto substrates, leading to enhanced product quality and production yield.
Original Abstract Submitted
An imprint apparatus including a mold holding unit configured to hold a mold, an adjusting unit configured to adjust a pressure difference between a first pressure on a second surface on an opposite side of a first surface on which a pattern of the mold held by the mold holding unit is formed and a second pressure in a first space between a substrate and the first surface of the mold, and a control unit configured to control an imprint process, wherein the imprint process includes a separation process of separating the mold from a pattern made of a cured product of an imprint material on the substrate, and the control unit controls, in the separation process, the adjustment of the pressure difference by the adjusting unit so that the first pressure is smaller than the second pressure.
