18534714. DISPLAY DEVICE MANUFACTURING METHOD simplified abstract (Japan Display Inc.)
Contents
DISPLAY DEVICE MANUFACTURING METHOD
Organization Name
Inventor(s)
Shinichi Kawamura of Tokyo (JP)
DISPLAY DEVICE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18534714 titled 'DISPLAY DEVICE MANUFACTURING METHOD
Simplified Explanation: The patent application describes a manufacturing method that involves creating a partition with conductive and insulating layers, as well as forming a lower electrode and a rib.
- The method includes forming a partition with a conductive bottom portion, an insulating stem portion, and a top portion.
- The partition is created by layering conductive and insulating materials and then etching them to form the different portions.
- The etching process for the insulating material has a slower rate than the conductive material, ensuring precise formation of the partition.
Key Features and Innovation:
- Formation of a partition with distinct conductive and insulating layers.
- Etching process with different rates for conductive and insulating materials.
- Creation of lower electrode and rib components in the manufacturing process.
Potential Applications: This technology could be applied in the manufacturing of electronic components, sensors, and microdevices where precise partitioning is required.
Problems Solved: This technology addresses the need for precise partitioning of conductive and insulating materials in manufacturing processes.
Benefits:
- Improved accuracy in creating partitions with different material layers.
- Enhanced functionality of electronic components and microdevices.
- Streamlined manufacturing processes for complex structures.
Commercial Applications: The technology could be utilized in the production of advanced electronic devices, sensors for various industries, and microdevices for medical applications.
Prior Art: Readers can explore prior research on semiconductor manufacturing processes, conductive and insulating material layering techniques, and etching methods in microfabrication.
Frequently Updated Research: Stay informed about advancements in semiconductor manufacturing, materials science, and microdevice technology to enhance understanding of this innovative manufacturing method.
Questions about the Technology: 1. What are the potential implications of using different etching rates for conductive and insulating materials in manufacturing processes? 2. How does the precise formation of partitions with distinct layers improve the performance of electronic components and microdevices?
Original Abstract Submitted
According to one embodiment, a manufacturing method includes forming a lower electrode, forming a rib, and forming a partition including a conductive bottom portion, an insulating stem portion, and a top portion. The formation of the partition includes forming a first layer including a layer of a conductive first material, forming a second layer including a layer of an insulating second material, forming a third layer including a layer of a third material, forming the top, stem and bottom portions by first to third etching processes, respectively. An etching rate of the third material in the second etching process is lower than an etching rate of the second material in the second etching process.
