18533800. STACKED SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 STACKED SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACKED SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Package Innovation
- 1.13 Original Abstract Submitted
STACKED SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungduk Baek of Suwon-si (KR)
STACKED SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18533800 titled 'STACKED SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application consists of a base structure with multiple semiconductor chips stacked vertically on it. These chips have overlapping chip regions and different widths in different directions.
Key Features and Innovation
- Semiconductor package with stacked chips having overlapping chip regions.
- Chips with different widths in different directions.
- Scribe regions on opposite sides of chip regions.
- First semiconductor chip with greater width than the second semiconductor chip.
Potential Applications
This technology could be used in various electronic devices such as smartphones, tablets, and computers where space-saving and efficient stacking of semiconductor chips is required.
Problems Solved
This technology addresses the need for compact and efficient semiconductor packaging by allowing for stacked chips with overlapping regions and different widths.
Benefits
- Space-saving design
- Efficient stacking of semiconductor chips
- Improved performance in electronic devices
Commercial Applications
The semiconductor package innovation could have significant implications in the consumer electronics industry, leading to more compact and powerful devices.
Prior Art
Readers interested in prior art related to this technology could start by looking into patents or research papers on semiconductor packaging techniques and advancements in the field.
Frequently Updated Research
Stay updated on the latest research and developments in semiconductor packaging techniques to ensure the most efficient and cutting-edge solutions are being utilized.
Questions about Semiconductor Package Innovation
What are the potential drawbacks of using stacked semiconductor chips with overlapping regions?
Stacked semiconductor chips with overlapping regions may face challenges related to heat dissipation and signal interference. Proper thermal management and signal isolation techniques would need to be implemented to mitigate these issues.
How does the different widths of the semiconductor chips in different directions affect the overall performance of the semiconductor package?
The varying widths of the semiconductor chips allow for more efficient use of space and can contribute to better thermal management and signal integrity within the package. This design feature can enhance the overall performance and reliability of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes a base structure and a plurality of semiconductor chips disposed on the base structure. Each of the plurality of semiconductor chips has a chip region. The plurality of semiconductor chips are stacked in a vertical direction such that chip regions at least partially overlap each other. In the stack of the plurality of semiconductor chips, each of the plurality of semiconductor chips has a first width in a first direction and a second width in a second direction. The plurality of semiconductor chips include a first semiconductor chip and a second semiconductor chip, having scribe regions on opposite sides of each of the chip regions. A first width of the first semiconductor chip is greater than a first width of the second semiconductor chip.
