18533256. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Shota Umezaki of Koshi City (JP)
Mikio Nakashima of Koshi City (JP)
Takahiro Hayashida of Koshi City (JP)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18533256 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The patent application describes a substrate processing apparatus that utilizes a supercritical processing fluid to dry a substrate to which a liquid adheres.
- The apparatus includes a processing container for accommodating the substrate, a holder for holding the substrate in a horizontal posture inside the container, and a fluid supplier for supplying the supercritical processing fluid.
- The fluid supplier includes a first direction change member to alter the flow of the fluid supplied from the substrate radially outward, ensuring it does not come in contact with the radial outer end of the substrate.
Potential Applications:
- This technology can be used in semiconductor manufacturing processes where precise drying of substrates is crucial.
- It can also be applied in the production of optical coatings and thin films where uniform drying is essential.
Problems Solved:
- The technology addresses the challenge of efficiently drying substrates with liquid residues without causing damage or contamination.
Benefits:
- Improved substrate drying process leading to higher quality end products.
- Enhanced efficiency and precision in substrate processing.
Commercial Applications:
- This technology can be valuable in industries such as semiconductor manufacturing, optics, and electronics where precise substrate processing is essential for product quality.
Questions about the technology: 1. How does the first direction change member in the fluid supplier contribute to the drying process? 2. What are the advantages of using a supercritical processing fluid for drying substrates compared to traditional methods?
Original Abstract Submitted
A substrate processing apparatus includes: a processing container in which a substrate is accommodated; a holder configured to hold the substrate in a horizontal posture at a holding position inside the processing container; and a fluid supplier configured to supply, into the processing container, a supercritical processing fluid for drying the substrate to which a liquid adheres, wherein the fluid supplier includes a first direction change member configured to change a flow of the supercritical processing fluid, supplied radially outward from the substrate held by the holder, in a direction that does not come in contact with a radial outer end of the substrate.
