18533024. THERMAL ISOLATION FOR MEMORY SYSTEMS simplified abstract (Micron Technology, Inc.)
Contents
- 1 THERMAL ISOLATION FOR MEMORY SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL ISOLATION FOR MEMORY SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Thermal Isolation for Memory Systems
- 1.13 Original Abstract Submitted
THERMAL ISOLATION FOR MEMORY SYSTEMS
Organization Name
Inventor(s)
Suresh Reddy Yarragunta of Bangalore (IN)
Deepu Narasimiah Subhash of Bangalore (IN)
THERMAL ISOLATION FOR MEMORY SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18533024 titled 'THERMAL ISOLATION FOR MEMORY SYSTEMS
Simplified Explanation
The patent application describes methods, systems, and devices for thermal isolation in memory systems using enclosed heatsink architectures to prevent overheating and improve efficiency.
- Enclosed heatsink architectures impede heat transfer between different components.
- Examples include partitions between heatsinks and overlapping heatsink designs.
- The architecture reduces overheating, improves durability, and enhances performance of memory devices.
Key Features and Innovation
- Thermal isolation for memory systems using enclosed heatsink architectures.
- Partition between heatsinks to prevent heat transfer.
- Overlapping heatsink design for increased heat exchange.
- Upper and lower heatsinks to enhance cooling efficiency.
Potential Applications
The technology can be applied in various memory systems, such as computer RAM, graphics cards, and servers.
Problems Solved
- Device overheating and thermal throttling.
- Improved life expectancy, durability, and efficiency of memory devices.
Benefits
- Reduced energy costs.
- Enhanced cooling efficiency.
- Increased performance and longevity of memory devices.
Commercial Applications
- The technology can be used in the manufacturing of computer hardware, data centers, and other electronic devices to improve thermal management and overall performance.
Prior Art
Readers can explore prior research on thermal management in memory systems, heatsink designs, and device cooling technologies.
Frequently Updated Research
Stay updated on advancements in thermal management technologies, heatsink materials, and device cooling methods.
Questions about Thermal Isolation for Memory Systems
How does the enclosed heatsink architecture prevent overheating in memory systems?
The enclosed heatsink architecture creates a barrier between components, reducing heat transfer and preventing overheating.
What are the potential commercial applications of this technology beyond memory systems?
The technology can be applied in various electronic devices and data centers to improve thermal management and overall performance.
Original Abstract Submitted
Methods, systems, and devices for thermal isolation for memory systems are described. The enclosed heatsink architectures may impede heat transfer from a first group of components to a second group components. Some examples include a partition (an air gap or other thermally insulating material) between multiple heatsinks. The heatsinks may each have heat transfer elements with various structures. In some examples, a first heatsink may overlap a second heatsink. The overlapping architecture may increase the size of the heatsink corresponding to the first set of components and increase their rate of heat exchange. In some examples, the heatsink architecture may include upper heatsinks and lower heatsinks. The enclosed heatsink architectures may reduce device overheating and time spent in thermal throttling, as well as improve the life expectancy, durability, efficiency, and performance of the memory devices. Increased efficiency in cooling the device may save energy costs.
