18532726. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kohei Tanikawa of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18532726 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a conductive substrate with a first switching semiconductor element, a first conductive member for passing main circuit current, and a sealing resin covering these components.
- The substrate has first and second conductive portions spaced in a direction orthogonal to the thickness direction.
- The semiconductor element is bonded to the first conductive portion.
- The conductive member overlaps with the first and second conductive portions and includes a first opening.
Potential Applications: - Power electronics - Automotive industry - Renewable energy systems
Problems Solved: - Efficient switching of main circuit current - Protection of semiconductor elements - Enhanced durability and reliability
Benefits: - Improved performance of electronic devices - Increased efficiency in power management - Extended lifespan of semiconductor components
Commercial Applications: Title: Advanced Semiconductor Devices for Power Electronics This technology can be utilized in various industries such as automotive, renewable energy, and consumer electronics for enhanced power management and improved device reliability.
Questions about Semiconductor Devices: 1. How does the design of this semiconductor device contribute to improved power management? 2. What are the key advantages of using a sealing resin in protecting semiconductor elements?
Frequently Updated Research: Researchers are continually exploring new materials and designs to enhance the efficiency and reliability of semiconductor devices for various applications. Stay updated on the latest advancements in power electronics and semiconductor technology.
Original Abstract Submitted
A semiconductor device includes a conductive substrate including an obverse surface facing a first side in thickness direction and a reverse surface opposite from the obverse surface, a first switching semiconductor element bonded to the obverse surface, a first conductive member for passing main circuit current switched by the semiconductor element, and a sealing resin covering the semiconductor element, the conductive member and a part of the substrate. The substrate includes first and second conductive portions mutually spaced in first direction orthogonal to thickness direction. The semiconductor element is electrically bonded to the first conductive portion. The conductive member includes a first part overlapping with the first and the second conductive portions as viewed in thickness direction and being spaced from the obverse surface toward the first side in thickness direction. The first part includes a first opening.
