18532468. PLASMA PROCESSING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

PLASMA PROCESSING EQUIPMENT

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Hee Won Min of Suwon-si (KR)

Song Yun Kang of Suwon-si (KR)

Ju Ho Kim of Suwon-si (KR)

Seok Hwan Bae of Suwon-si (KR)

Dong Yun Yeo of Suwon-si (KR)

Kui Hyun Yoon of Suwon-si (KR)

Seung Bin Lim of Suwon-si (KR)

Ji Yun Ju of Suwon-si (KR)

Seo Yeon Choi of Suwon-si (KR)

PLASMA PROCESSING EQUIPMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18532468 titled 'PLASMA PROCESSING EQUIPMENT

The abstract describes a plasma processing equipment that includes an electrostatic chuck, a gas filling unit, a gas supply unit with nonconductive balls, and a focus ring.

• Electrostatic chuck for holding the substrate
• Gas filling unit between the substrate and the chuck
• Gas supply unit with nonconductive balls for supplying gas
• Focus ring along the edge of the chuck for enhanced processing

Potential Applications: - Semiconductor manufacturing - Thin film deposition - Surface modification processes

Problems Solved: - Improved gas distribution for more uniform processing - Enhanced substrate stability during plasma processing

Benefits: - Higher processing efficiency - Better control over processing parameters - Increased yield and quality of manufactured products

Commercial Applications: Title: "Advanced Plasma Processing Equipment for Semiconductor Manufacturing" This technology can be used in semiconductor fabrication facilities to improve processing efficiency and product quality. It can also be applied in industries requiring precise surface modification processes.

Questions about Plasma Processing Equipment: 1. How does the gas supply unit with nonconductive balls improve the plasma processing efficiency? - The nonconductive balls help in distributing the gas evenly, ensuring uniform processing.

2. What role does the focus ring play in the plasma processing equipment? - The focus ring helps in maintaining the stability of the substrate during processing, leading to better results.

Original Abstract Submitted

A plasma processing equipment includes: an electrostatic chuck on which a substrate is provided; a gas filling unit provided between the substrate and the electrostatic chuck; a gas supply unit extending through the electrostatic chuck and connected to the gas filling unit, the gas supply unit comprising a plurality of first nonconductive balls; and a focus ring provided along an edge of the electrostatic chuck.