18531854. ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME simplified abstract (Samsung Display Co., LTD.)

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ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME

Organization Name

Samsung Display Co., LTD.

Inventor(s)

Je Hyeon Yoon of Yongin-si (KR)

ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18531854 titled 'ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME

The alignment apparatus described in the patent application consists of a support substrate with a first alignment mark and a wafer aligned to this mark.

  • The first alignment mark includes a first mark extending in one direction, a second mark intersecting the first mark at one side, and a third mark intersecting the first mark at another side.
  • This unique alignment mark configuration allows for precise alignment of the wafer on the support substrate.
  • The design of the alignment mark enables accurate positioning of the wafer for various manufacturing processes.
  • The apparatus ensures consistent and reliable alignment of the wafer, leading to improved overall product quality.
  • The alignment apparatus can be used in semiconductor manufacturing, microelectronics, and other industries requiring precise alignment of components.

Potential Applications:

  • Semiconductor manufacturing
  • Microelectronics industry
  • Optics and photonics industry

Problems Solved:

  • Ensures accurate alignment of wafers during manufacturing processes
  • Improves overall product quality and consistency
  • Reduces errors and rework in manufacturing operations

Benefits:

  • Enhanced precision in alignment processes
  • Improved product quality and reliability
  • Increased efficiency in manufacturing operations

Commercial Applications:

  • The alignment apparatus can be used in semiconductor fabrication facilities, microelectronics manufacturing plants, and other industries requiring precise alignment of components.

Questions about the alignment apparatus: 1. How does the unique alignment mark configuration improve the accuracy of wafer alignment? 2. What are the potential cost-saving benefits of using this alignment apparatus in manufacturing processes?

Frequently Updated Research:

  • Stay updated on the latest advancements in alignment technology for semiconductor manufacturing and microelectronics industries.


Original Abstract Submitted

An alignment apparatus includes a support substrate having a first alignment mark formed thereon, and a wafer mounted on the support substrate as aligned to the first alignment mark. The first alignment mark includes a first mark extending in a first direction, a second mark extending in a second direction and intersecting the first mark at a side of the first mark, and a third mark extending in the second direction and intersecting the first mark at another side of the first mark.

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