18530856. ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
Contents
ELECTRONIC COMPONENT
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18530856 titled 'ELECTRONIC COMPONENT
Simplified Explanation:
This patent application describes an electronic component with a multilayered capacitor, a frame terminal, and a conductive bonding portion. The frame terminal has a base portion made of a first material and a surface portion made of a second material, with specific thermal expansion coefficients.
- The electronic component includes a multilayered capacitor with an external electrode.
- A frame terminal mounts the capacitor on a board.
- A conductive bonding portion is placed between the board and the frame terminal.
- The frame terminal has a base portion and a surface portion with different materials.
- The thermal expansion coefficient of the frame terminal is carefully chosen.
Key Features and Innovation:
- Multilayered capacitor design with specific materials for the frame terminal.
- Unique thermal expansion coefficients for different components.
- Improved stability and reliability of the electronic component.
Potential Applications:
- Electronics manufacturing.
- Circuit board assembly.
- Consumer electronics.
Problems Solved:
- Ensuring proper mounting and stability of electronic components.
- Addressing thermal expansion issues in electronic devices.
Benefits:
- Enhanced performance and durability.
- Improved quality control in electronics manufacturing.
Commercial Applications:
- This technology could be used in the production of various electronic devices, ensuring better performance and longevity.
- It may have applications in industries such as telecommunications, automotive, and aerospace.
Questions about Electronic Components:
1. How does the choice of materials in the frame terminal impact the overall performance of the electronic component? 2. What are the specific challenges in designing electronic components with different thermal expansion coefficients?
Original Abstract Submitted
An electronic component includes a multilayered capacitor including a capacitor body and an external electrode disposed on one surface of the capacitor body, a frame terminal mounting the multilayered capacitor on a board, and a conductive bonding portion disposed between the board and the frame terminal. The frame terminal includes a base portion including a first material and a surface portion including a second material, and a coefficient of thermal expansion of the frame terminal is greater than that of the capacitor body and is smaller than that of the conductive bonding portion.
