18530646. BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS simplified abstract (THE BOEING COMPANY)
Contents
BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS
Organization Name
Inventor(s)
George E. Bible of Chesterfield MO (US)
Peter M. Winzek of Clayton MO (US)
BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18530646 titled 'BOND ASSEMBLY JIG PREPARATION METHODS USING THERMOSETTING BISMALEIMIDE RESINS
Simplified Explanation:
The method involves creating a cutter relief groove in a bond assembly jig (BAJ), filling it with a material, and curing the material.
- Forming a cutter relief groove in the BAJ
- Filling the groove with a material
- Curing the material after filling
Key Features and Innovation:
- Innovative method for preparing a bond assembly jig
- Utilizes a cutter relief groove to enhance the assembly process
- Incorporates a curing step to solidify the material in the groove
Potential Applications:
This technology can be applied in industries that require precise bonding processes, such as electronics manufacturing and automotive assembly.
Problems Solved:
- Improves the efficiency and accuracy of bond assembly processes
- Enhances the stability and durability of bonded components
Benefits:
- Streamlines the assembly process
- Ensures strong and reliable bonds
- Reduces the risk of errors and defects
Commercial Applications:
Potential commercial applications include the production of electronic devices, medical equipment, and aerospace components.
Prior Art:
Readers can explore prior art related to bond assembly jigs, cutter relief grooves, and material curing processes in the field of manufacturing and engineering.
Frequently Updated Research:
Stay updated on advancements in bond assembly techniques, materials science, and industrial automation to further enhance the efficiency and effectiveness of this technology.
Questions about Bond Assembly Jigs:
1. What are the different types of materials that can be used to fill the cutter relief groove in a bond assembly jig? 2. How does the curing process impact the strength and durability of the bond assembly?
Original Abstract Submitted
A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.
