18529057. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Gentaro Goshi of Koshi City (JP)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18529057 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The patent application describes a substrate processing apparatus that includes a liquid processing device to supply a processing liquid onto a substrate and form a liquid film on its surface.
- The apparatus includes a buffer tank to store the processing liquid, a supply pipe to connect the liquid source, buffer tank, and nozzle, and a supply controller to regulate the supply of the processing liquid.
- It also features a dissolved oxygen concentration measuring device to monitor the oxygen levels in the liquid and a controller to determine whether to supply the liquid based on the measurement results.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Ensures precise control of processing liquid supply - Maintains optimal dissolved oxygen levels for processing
Benefits: - Improved substrate processing quality - Enhanced process efficiency - Reduced material waste
Commercial Applications: - Advanced manufacturing industries - Research and development facilities - Semiconductor fabrication plants
Prior Art: Prior art related to this technology may include patents or research papers on substrate processing equipment with liquid supply control systems and dissolved oxygen monitoring devices.
Frequently Updated Research: Researchers may be exploring ways to optimize dissolved oxygen levels in processing liquids for various applications, including substrate processing.
Questions about the Technology: 1. How does the apparatus ensure precise control of the processing liquid supply? 2. What are the potential benefits of maintaining optimal dissolved oxygen levels in substrate processing?
Original Abstract Submitted
A substrate processing apparatus includes a liquid processing device configured to supply a processing liquid onto a substrate from a nozzle and form a liquid film of the processing liquid on a surface of the substrate; a processing liquid supply comprising: a buffer tank configured to store therein the processing liquid supplied from a processing liquid source; a supply pipe configured to connect the processing liquid source, the buffer tank and the nozzle; and a supply controller configured to perform a supply and a stop of the supply of the processing liquid to the nozzle; a dissolved oxygen concentration measuring device configured to measure a dissolved oxygen concentration in the processing liquid; and a controller configured to determine whether or not to supply the processing liquid to the substrate based on a measurement result, and configured to control the supply controller based on a determination result.
