18528713. POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT simplified abstract (EBARA CORPORATION)
Contents
POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT
Organization Name
Inventor(s)
YOSHITAKA Kitagawa of Tokyo (JP)
POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18528713 titled 'POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT
Simplified Explanation:
The polishing device described in the patent application aims to reduce variations in responsiveness of multiple pressure regulators by utilizing buffer tanks with volume adjustment devices.
- The polishing device includes multiple buffer tanks, each consisting of a tank section made of a rigid body and a volume adjustment device.
- The volume adjustment device is responsible for adjusting the volume of the buffer tank, ensuring consistent responsiveness of the pressure regulators.
- By reducing variations in responsiveness, the polishing device enhances the overall performance and efficiency of the pressure regulators.
Key Features and Innovation:
- Utilization of buffer tanks with volume adjustment devices.
- Rigid body tank sections for durability and stability.
- Reduction of variations in responsiveness of multiple pressure regulators.
Potential Applications:
The technology can be applied in various industries such as manufacturing, automotive, and aerospace where precise pressure regulation is crucial.
Problems Solved:
The technology addresses the issue of inconsistent responsiveness in multiple pressure regulators, leading to improved performance and efficiency.
Benefits:
- Enhanced performance and efficiency of pressure regulators.
- Consistent pressure regulation across multiple regulators.
- Increased reliability and stability in pressure control systems.
Commercial Applications:
Title: "Advanced Pressure Regulator Polishing Device for Enhanced Performance in Industrial Applications"
The technology can be commercialized for use in industrial pressure control systems, offering improved performance and efficiency in manufacturing processes.
Questions about Pressure Regulator Polishing Device:
1. What are the key components of the polishing device described in the patent application?
- The key components include buffer tanks with volume adjustment devices and rigid body tank sections.
2. How does the polishing device help in reducing variations in responsiveness of multiple pressure regulators?
- The polishing device ensures consistent pressure regulation by adjusting the volume of the buffer tanks, leading to improved performance and efficiency.
Original Abstract Submitted
A polishing device is capable of reducing variations in responsiveness of multiple pressure regulators. The polishing device includes multiple buffer tanks T to T Each of the buffer tanks T to T includes a tank section made of a rigid body and a volume adjustment device which adjusts a volume of the buffer tank.
