18527552. BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
Contents
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
KENICHIRO Mori of Tochigi (JP)
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18527552 titled 'BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
The present invention describes a bonding apparatus for bonding a second object to a first object by activating the bonding surface of the second object before the bonding process.
- Holder to hold the second object during the bonding process.
- Surface treatment device to activate the bonding surface of the second object.
- Controller to control the bonding process after surface treatment, ensuring proper bonding of the second object to the first object.
Potential Applications: This technology can be used in industries such as electronics, automotive, and aerospace for bonding components together securely.
Problems Solved: This technology addresses the challenge of achieving strong and reliable bonds between different objects by pre-treating the bonding surface.
Benefits: Enhanced bonding strength, improved reliability of bonded components, and precise control over the bonding process.
Commercial Applications: This technology can be utilized in manufacturing processes where bonding of different materials is required, leading to more efficient production and higher quality products.
Prior Art: Researchers can explore prior patents related to bonding apparatus and surface treatment devices to understand the evolution of this technology.
Frequently Updated Research: Stay informed about advancements in surface treatment techniques and bonding processes to enhance the efficiency and effectiveness of this technology.
Questions about Bonding Apparatus: 1. How does the surface treatment device activate the bonding surface of the second object? 2. What are the key advantages of using a holder in the bonding process?
Original Abstract Submitted
The present invention provides a bonding apparatus for performing a bonding process of bonding, to one of a plurality of regions in a first object to be bonded, a second object to be bonded, comprising: a holder configured to hold the second object; a surface treatment device configured to perform a surface treatment which includes activating a surface state of a target bonding surface of the second object held by the holder; and a controller configured to, after the surface treatment is performed for the second object by the surface treatment device, control the bonding process such that the second object is bonded to one of the plurality of regions in a state in which the second object is held by the holder.
