18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS

Organization Name

Lodestar Licensing Group LLC

Inventor(s)

Thomas H. Kinsley of Boise ID (US)

George E. Pax of Boise ID (US)

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18526964 titled 'SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS

Simplified Explanation

The abstract describes a semiconductor device with pass-through clock traces, including a package substrate, first and second semiconductor dies, and electrical connectors.

• The semiconductor device includes a package substrate with substrate contacts, a first semiconductor die attached to the substrate, and a second semiconductor die stacked on top.
• The first semiconductor die has a first conductive contact on its upper surface, while the second semiconductor die has a second conductive contact.
• Electrical connectors link the substrate contacts to the conductive contacts on both dies.

Potential Applications

This technology could be applied in high-performance computing, telecommunications, and consumer electronics where efficient clock signal distribution is crucial.

Problems Solved

This innovation solves the challenge of distributing clock signals efficiently within a semiconductor package, reducing signal interference and improving overall system performance.

Benefits

The use of pass-through clock traces in semiconductor packages can lead to faster data processing, lower power consumption, and improved reliability in electronic devices.

Potential Commercial Applications

"Pass-Through Clock Traces in Semiconductor Packages: Enhancing Signal Distribution Efficiency"

Possible Prior Art

There may be prior art related to clock signal distribution techniques in semiconductor packages, but specific examples are not provided in this abstract.

How does this technology impact the overall size of the semiconductor device?

The abstract does not mention how the addition of pass-through clock traces affects the size or form factor of the semiconductor device.

What are the potential limitations or drawbacks of using pass-through clock traces in semiconductor packages?

The abstract does not address any potential limitations or drawbacks that may arise from implementing this technology.

Original Abstract Submitted

Semiconductor packages with pass-through clock traces and associated devices, systems, and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate including a first surface having a plurality of substrate contacts, a first semiconductor die having a lower surface attached to the first surface of the package substrate, and a second semiconductor die stacked on top of the first semiconductor die. The first semiconductor die includes an upper surface including a first conductive contact, and the second semiconductor die includes a second conductive contact. A first electrical connector electrically couples a first one of the plurality of substrate contacts to the first and second conductive contacts, and a second electrical connector electrically couples a second one of the plurality of substrate contacts to the first and second conductive contacts.