18526697. SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE
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SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18526697 titled 'SEMICONDUCTOR PACKAGE INCLUDING DUMMY PACKAGE
The present disclosure introduces semiconductor packages with dummy packages, including a solid-state drive (SSD) device with a printed circuit board, memory packages, and at least one dummy package for dissipating heat.
- The semiconductor package comprises a solid-state drive (SSD) device with a printed circuit board, memory packages, and at least one dummy package.
- The dummy package is electrically connected to the printed circuit board and includes a first pad that acts as a heat path for dissipating heat from the printed circuit board.
Potential Applications:
- This technology can be applied in the manufacturing of solid-state drives (SSDs) to improve heat dissipation and overall performance.
- It can also be used in other semiconductor devices where heat management is crucial for efficient operation.
Problems Solved:
- Improved heat dissipation in semiconductor packages.
- Enhanced performance and reliability of solid-state drives (SSDs) through effective heat management.
Benefits:
- Better heat dissipation capabilities leading to improved performance and longevity of semiconductor devices.
- Enhanced reliability and efficiency of solid-state drives (SSDs) due to effective heat management.
Commercial Applications:
- This technology can be utilized in the production of high-performance solid-state drives (SSDs) for consumer electronics, data centers, and industrial applications.
- It can also be integrated into other semiconductor devices where heat dissipation is a critical factor for optimal performance.
Questions about Semiconductor Packages with Dummy Packages: 1. How does the inclusion of dummy packages improve heat dissipation in semiconductor packages? 2. What are the potential applications of this technology beyond solid-state drives (SSDs)?
Frequently Updated Research: Ongoing research in the field of semiconductor packaging focuses on improving heat dissipation techniques to enhance the performance and reliability of electronic devices.
Original Abstract Submitted
The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.
