18525410. METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT simplified abstract (Robert Bosch GmbH)
Contents
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
Organization Name
Inventor(s)
Johannes Classen of Reutlingen (DE)
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18525410 titled 'METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT
The patent application describes a method for producing a microelectromechanical component.
- A dielectric layer is structured on the upper side of a substrate to form a grating.
- A blind hole is formed beneath the grating.
- A cover layer is placed on the dielectric layer to close the blind hole.
- A layer sequence is arranged on the cover layer and above the blind hole.
- Functional structures are created in the layer sequence.
- An access channel extending through the layer sequence to the blind hole is formed.
- Another substrate is connected to the main substrate.
- The functional structures are enclosed in a cavity connected to the blind hole between the two substrates.
- A cavity internal pressure is set, and the blind hole is closed.
- Another blind hole is formed on the underside of the substrate, opened in the region of the first blind hole.
Potential Applications: - MEMS devices - Sensors - Actuators
Problems Solved: - Integration of functional structures in a compact space - Ensuring proper sealing and pressure control in cavities
Benefits: - Compact design - Improved performance of MEMS components - Enhanced reliability and durability
Commercial Applications: Title: "Advanced MEMS Component Manufacturing for High-Performance Devices" This technology can be utilized in industries such as consumer electronics, automotive, aerospace, and medical devices for the production of high-performance MEMS components.
Prior Art: Prior research in MEMS technology and microfabrication processes can provide insights into similar methods and techniques used in the field.
Frequently Updated Research: Ongoing research in MEMS technology focuses on improving fabrication processes, materials, and design techniques for enhanced performance and functionality.
Questions about MEMS Component Manufacturing: 1. How does this method compare to traditional MEMS fabrication processes? 2. What are the potential challenges in scaling up production using this technique?
Original Abstract Submitted
A method producing a microelectromechanical component. A dielectric layer is structured on an upper side of a substrate forming a grating, and a blind hole is formed beneath the grating. A cover layer is arranged on the dielectric layer closing the blind hole. A layer sequence is arranged on the cover layer and above the blind hole. Functional structures are formed in the layer sequence and an access channel extending through the layer sequence to the blind hole is formed. A further substrate is connected to the substrate. The functional structures are enclosed in a cavity, connected to the blind hole, between the substrate and the further substrate. Another blind hole is formed on an underside of the substrate. The blind hole is opened in the region of the other blind hole. A cavity internal pressure is set, and the blind hole is closed.
