18525403. REPAIR TECHNIQUES FOR COUPLED MEMORY DIES simplified abstract (Micron Technology, Inc.)
Contents
- 1 REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 REPAIR TECHNIQUES FOR COUPLED MEMORY DIES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Repair Techniques for Coupled Host and Memory Dies
- 1.13 Original Abstract Submitted
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
Organization Name
Inventor(s)
James Brian Johnson of Boise ID (US)
Kunal R. Parekh of Boise ID (US)
Eiichi Nakano of Boise ID (US)
Amy Rae Griffin of Boise ID (US)
REPAIR TECHNIQUES FOR COUPLED MEMORY DIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18525403 titled 'REPAIR TECHNIQUES FOR COUPLED MEMORY DIES
Simplified Explanation
The patent application describes methods, systems, and devices for repair techniques for coupled host and memory dies. These techniques involve distributing memory access circuitry among multiple semiconductor dies in a stack to support various repair techniques for memory arrays.
- The patent application focuses on distributing memory access circuitry among multiple semiconductor dies in a stack.
- The techniques include repair methods for column failures, serialization failures, and interconnection failures between dies.
- Differentiated repair techniques are based on the attribution of error conditions.
Key Features and Innovation
- Distribution of memory access circuitry among multiple semiconductor dies.
- Support for various repair techniques for memory arrays.
- Differentiated repair techniques based on error conditions.
Potential Applications
The technology can be applied in semiconductor manufacturing, memory systems, and integrated circuits.
Problems Solved
- Addressing column failures in memory arrays.
- Handling serialization failures in memory operations.
- Resolving interconnection failures between semiconductor dies.
Benefits
- Improved reliability of memory systems.
- Enhanced fault tolerance in semiconductor devices.
- Efficient repair techniques for memory arrays.
Commercial Applications
Repair Techniques for Coupled Host and Memory Dies in Semiconductor Manufacturing
This technology can be utilized in the semiconductor industry to enhance the reliability and fault tolerance of memory systems. By implementing differentiated repair techniques based on error conditions, manufacturers can improve the overall performance and longevity of semiconductor devices.
Prior Art
Research in the field of semiconductor manufacturing and memory systems may provide insights into prior art related to repair techniques for coupled host and memory dies.
Frequently Updated Research
Ongoing research in semiconductor manufacturing and memory systems may lead to advancements in repair techniques for coupled host and memory dies.
Questions about Repair Techniques for Coupled Host and Memory Dies
What are the key benefits of distributing memory access circuitry among multiple semiconductor dies?
Distributing memory access circuitry among multiple semiconductor dies allows for improved fault tolerance and reliability in memory systems. It also enables efficient repair techniques for memory arrays.
How do differentiated repair techniques based on error conditions enhance the performance of semiconductor devices?
By tailoring repair techniques to specific error conditions, manufacturers can address issues such as column failures, serialization failures, and interconnection failures more effectively, leading to improved overall performance and longevity of semiconductor devices.
Original Abstract Submitted
Methods, systems, and devices for repair techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of circuitry configured to access the set of memory arrays, and a second die may include a second portion of circuitry configured to access the set of memory arrays. The second portion of the circuitry (e.g., of the second die) may be configured to support various repair techniques for operations with the set of memory arrays, including techniques in response to column failures or serialization failures associated with the first die, or in response to contact or other interconnection failures with or between the first die and the second die, among other techniques that may be differentiated based on an attribution of error conditions.
