18524726. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SEMES CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS AND METHOD
Organization Name
Inventor(s)
Hee Man Ahn of Cheonan-si (KR)
Sung Hun Eom of Cheonan-si (KR)
Gyeong Won Song of Cheonan-si (KR)
Jae Seung Yu of Cheonan-si (KR)
SUBSTRATE PROCESSING APPARATUS AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18524726 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD
Simplified Explanation: The patent application describes a substrate processing apparatus and method that can precisely control the surrounding humidity environment during a heat-treatment process, such as baking, based on the photoresist for extreme ultraviolet (EUV) applied on the substrate.
- The substrate processing apparatus includes a housing with a treatment space, a support unit for holding the substrate, and a gas supply unit that alternately supplies different gases into the treatment space in response to the photoresist for EUV applied on the substrate.
- The apparatus allows for the precise control of the humidity environment during the heat-treatment process, which is crucial for ensuring the quality of the photoresist for EUV on the substrate.
- By adjusting the humidity environment based on the photoresist for EUV, the apparatus can optimize the heat-treatment process and improve the overall efficiency and effectiveness of the substrate processing.
- This innovation can lead to enhanced performance and quality in the production of substrates with photoresist for EUV, which is essential for advanced semiconductor manufacturing processes.
- The technology offers a more advanced and precise method for handling substrates with photoresist for EUV, contributing to the advancement of semiconductor manufacturing processes.
Potential Applications: This technology can be applied in the semiconductor industry for the production of advanced substrates with photoresist for extreme ultraviolet lithography.
It can also be utilized in research and development facilities working on cutting-edge semiconductor technologies that require precise control of the surrounding humidity environment during heat-treatment processes.
Problems Solved: This technology addresses the challenge of maintaining optimal humidity levels during heat-treatment processes for substrates with photoresist for EUV, ensuring high-quality results in semiconductor manufacturing.
It solves the problem of inconsistent humidity control, which can negatively impact the performance and quality of the photoresist for EUV on the substrate.
Benefits: Improved quality and performance of substrates with photoresist for EUV in semiconductor manufacturing processes.
Enhanced efficiency and effectiveness of heat-treatment processes, leading to higher productivity and cost savings.
Optimized control of the surrounding humidity environment, resulting in better overall outcomes in semiconductor manufacturing.
Commercial Applications: Commercial applications of this technology include semiconductor manufacturing facilities, research institutions, and companies involved in the production of advanced electronic devices.
The technology can have significant market implications by offering a more advanced and precise method for handling substrates with photoresist for EUV, meeting the increasing demand for high-quality semiconductor products.
Questions about Substrate Processing Apparatus and Method: 1. How does the substrate processing apparatus control the surrounding humidity environment during the heat-treatment process? 2. What are the potential benefits of using this technology in semiconductor manufacturing processes?
Original Abstract Submitted
Disclosed are a substrate processing apparatus and method in which in a heat-treatment process such as a baking process, a surrounding humidity environment may be precisely controlled based on photoresist for extreme ultraviolet (EUV) applied on the substrate. The substrate processing apparatus includes a housing having a treatment space defined therein; a support unit for supporting, thereon, a substrate received in the treatment space; and a gas supply unit configured to alternately supply a first gas and a second gas into the treatment space in response to photoresist (PR) for extreme ultraviolet (EUV) applied onto the substrate.
