18524454. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Tae Yeong Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18524454 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of multiple layers of silicon oxide and silicon on a substrate, with varying concentrations of silicon in each layer.
- The first insulating layer on the substrate contains silicon oxide with a high concentration of silicon, while the second insulating layer on top of it also contains silicon oxide but with a lower concentration of silicon.
- The concentration of silicon in the first insulating layer is between 20 wt % to 50 wt %, while the second insulating layer has a lower concentration than the first.
- A structure is present on the second insulating layer, which completes the semiconductor package design.
Potential Applications: This technology can be used in the manufacturing of advanced semiconductor devices, such as integrated circuits and microprocessors. It can also be applied in the development of high-performance electronic components for various industries, including telecommunications and automotive.
Problems Solved: This innovation addresses the need for improved insulation and protection of semiconductor components, enhancing their overall performance and reliability. It also allows for more efficient heat dissipation and electrical conductivity within the package.
Benefits: Enhanced performance and reliability of semiconductor devices. Improved heat dissipation and electrical conductivity. Potential for smaller and more compact electronic products.
Commercial Applications: This technology has commercial applications in the semiconductor industry, where high-performance and reliable components are essential for various electronic devices. It can also be utilized in the development of advanced consumer electronics, medical devices, and industrial equipment.
Questions about the technology: 1. How does the varying concentration of silicon in the insulating layers impact the overall performance of the semiconductor package? 2. What are the specific advantages of using silicon oxide in the insulating layers of the semiconductor package?
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology, including research on new materials and manufacturing processes to further improve performance and efficiency.
Original Abstract Submitted
A semiconductor package includes a first substrate including silicon, a first insulating layer in contact with the first substrate, the first insulating layer including silicon oxide, the first insulating layer having a first concentration of silicon, a second insulating layer in contact with the first insulating layer, the second insulating layer including silicon oxide, the second insulating layer having a second concentration of silicon, the second concentration lower than the first concentration, and a structure on the second insulating layer. The first concentration is a ratio of a weight of silicon in the first insulating layer to a total weight of the first insulating layer, the second concentration is a ratio of a weight of silicon in the second insulating layer to a total weight of the second insulating layer, and the first concentration is in a range from 20 wt % to 50 wt %.
