18524135. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seung Hyun Baik of Suwon-si (KR)
Won Hee Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18524135 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a substrate with a first and second direction, a first semiconductor chip stack, a second semiconductor chip stack, a first spacer with a coupling layer, and a mold layer covering the chip stacks.
- The package includes multiple semiconductor chip stacks stacked on top of each other, with the second chip stack spaced apart from the first in one direction.
- The first spacer features a coupling layer that plays a crucial role in the package's structure and functionality.
- The mold layer covers both the first and second semiconductor chip stacks, ensuring their protection and stability within the package.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, tablets, and computers. - It could also find applications in automotive electronics, industrial machinery, and medical devices.
Problems Solved: - The package design addresses the need for compact and efficient semiconductor chip stacking while ensuring proper spacing and protection.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced thermal management and overall durability of the semiconductor package.
Commercial Applications: - The technology could be utilized by semiconductor manufacturers to produce advanced and reliable electronic components for a wide range of industries.
Questions about the technology: 1. How does the coupling layer in the first spacer contribute to the overall functionality of the semiconductor package? 2. What are the specific advantages of having multiple semiconductor chip stacks in this package design?
Original Abstract Submitted
A semiconductor package includes: a substrate extending in first and second directions that intersect each other; a first semiconductor chip stack disposed on the substrate and including a plurality of first semiconductor chips stacked on each other, a second semiconductor chip stack disposed on the substrate, and spaced apart from the first semiconductor chip stack in the first direction, wherein the second semiconductor chip stack includes a plurality of second semiconductor chips stacked on each other, a first spacer disposed on the first semiconductor chip stack and including a coupling layer; and a mold layer covering the first and second semiconductor chip stacks and in contact with the first spacer.
