18523745. IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM
Organization Name
Inventor(s)
KEIJI Yamashita of Tochigi (JP)
IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523745 titled 'IMPRINT APPARATUS, ARTICLE MANUFACTURING METHOD, DETERMINATION METHOD, AND RECORDING MEDIUM
Simplified Explanation
The abstract describes an imprint apparatus that forms a pattern on an imprint material supplied on a substrate by bringing the material into contact with a mold. The apparatus includes a holding unit for the substrate, a supply unit for supplying a droplet of the imprint material to a partial region of the substrate, and a control unit for determining the position or amount of the droplet based on measurement data on the surface height of the partial region.
- The imprint apparatus forms patterns on imprint materials by bringing them into contact with a mold on a substrate.
- The apparatus includes a holding unit, a supply unit, and a control unit for precise positioning and supply of the imprint material.
- The control unit uses measurement data on the surface height of the substrate to determine the position or amount of the imprint material to be supplied.
Potential Applications
The technology can be used in the manufacturing of microelectronics, optical devices, and nanotechnology products where precise patterning is required.
Problems Solved
This technology solves the problem of accurately forming patterns on imprint materials by providing a controlled and precise supply of the material to the substrate.
Benefits
The benefits of this technology include improved pattern formation accuracy, increased efficiency in manufacturing processes, and the ability to create intricate patterns on substrates.
Potential Commercial Applications
The technology can be applied in industries such as semiconductor manufacturing, display technology, and biotechnology for the production of high-precision devices and components.
Possible Prior Art
Prior art in this field includes similar imprint apparatus designs used in the semiconductor industry for patterning processes.
Unanswered Questions
How does the imprint apparatus handle variations in substrate materials and sizes?
The abstract does not provide information on how the apparatus adjusts for different substrate materials and sizes during the imprint process.
What is the expected lifespan of the imprint apparatus components?
The abstract does not mention the durability or expected lifespan of the components used in the imprint apparatus.
Original Abstract Submitted
An imprint apparatus that performs an imprint process of forming a pattern on an imprint material supplied on a substrate by bringing the imprint material into contact with a mold. The imprint apparatus includes a holding unit configured to hold the substrate, a supply unit configured to supply a droplet of the imprint material to the substrate in a partial region, the partial region including an edge of the substrate and with which a part of a pattern region of the mold is to come into contact in the imprint process, and a control unit configured to determine a position or an amount of the droplet of the imprint material to be supplied to the partial region, based on measurement data on a surface height of the partial region in a state in which the holding unit holds the substrate.
