18523659. METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT
Organization Name
Inventor(s)
TAKAYUKI Teshima of Kanagawa (JP)
METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523659 titled 'METHOD FOR MANUFACTURING PHOTORESPONSIVE ARRAY ELEMENT
Simplified Explanation
The patent application describes a process where a resist layer containing a photoresponsive material is transferred from a film onto a bank substrate. Exposure and development are then carried out to remove the unexposed resist layer.
- Resist layer with photoresponsive material is transferred from a film to a bank substrate.
- Exposure and development process removes unexposed resist layer.
Potential Applications
This technology could be used in the manufacturing of microelectronics, photolithography, and semiconductor devices.
Problems Solved
This technology helps in creating precise patterns on substrates, enabling the production of high-quality electronic components.
Benefits
- Improved precision in patterning - Enhanced efficiency in manufacturing processes - Cost-effective production of electronic devices
Potential Commercial Applications
Optimizing Photoresist Layer Transfer for Semiconductor Manufacturing
Possible Prior Art
One possible prior art could be the use of photoresist layers in photolithography processes for creating patterns on substrates.
Unanswered Questions
How does this technology compare to existing methods in terms of cost-effectiveness?
Answer: This article does not provide a direct comparison with existing methods in terms of cost-effectiveness.
What are the environmental implications of using this technology compared to traditional methods?
Answer: The environmental impact of this technology is not discussed in the article.
Original Abstract Submitted
A resist layer containing a photoresponsive material in a photoresist is layer-transferred from a film on which the resist layer is formed to a bank substrate, and exposure and development are performed so as to remove an unexposed resist layer.
