18523320. SEMICONDUCTOR DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)

SEMICONDUCTOR DEVICE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Masao Kondo of Nagaokakyo-shi (JP)

Satoshi Goto of Nagaokakyo-shi (JP)

Takayuki Tsutsui of Nagaokakyo-shi (JP)

Shinnosuke Takahashi of Nagaokakyo-shi (JP)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18523320 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a stacked semiconductor device designed to increase heat dissipation by attaching a second member with a second electronic circuit to a first member with a first electronic circuit, allowing for improved cooling capabilities.

• The first member of the device includes a semiconductor substrate and a first electronic circuit with a semiconductor element.
• The second member is attached to the first member and includes a second electronic circuit with another semiconductor element.
• The second member has a first opening that penetrates through it, allowing a first conductor projection from the first electronic circuit to protrude to the outside through the opening.

Potential Applications

The technology could be applied in high-performance computing systems, data centers, and other electronic devices where heat dissipation is a critical factor.

Problems Solved

This innovation addresses the issue of heat buildup in stacked semiconductor devices, which can affect performance and longevity.

Benefits

The stacked semiconductor device offers improved heat dissipation, potentially leading to enhanced overall performance and reliability of electronic systems.

Potential Commercial Applications

• "Enhanced Heat Dissipation in Stacked Semiconductor Devices: Applications and Benefits"

Possible Prior Art

There may be prior art related to stacked semiconductor devices with improved heat dissipation capabilities, but specific examples are not provided in the abstract.

How does this technology compare to traditional heat dissipation methods in semiconductor devices?

The article does not provide a direct comparison between this technology and traditional heat dissipation methods. It would be interesting to know if this innovation significantly outperforms existing solutions in terms of cooling efficiency and cost-effectiveness.

What are the potential challenges in implementing this technology on a large scale in commercial electronic devices?

The abstract does not mention any potential challenges or limitations associated with implementing this technology in real-world applications. Understanding the obstacles that may arise during large-scale adoption could provide valuable insights for companies interested in utilizing this innovation.

Original Abstract Submitted

A stacked semiconductor device capable of increasing heat dissipation comprises a first member and a second member. The first member includes a semiconductor substrate and a first electronic circuit. The first electronic circuit includes a semiconductor element provided on one surface of the semiconductor substrate. A second member is attached to a first surface, which is one surface of the first member. The second member includes a second electronic circuit including another semiconductor element. The second member is provided with a first opening that penetrates the second member in a thickness direction. A first conductor projection is coupled to the first electronic circuit. The first conductor projection protrudes from the first surface of the first member through the first opening of the second member to the outside of the first opening.