18523255. LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL simplified abstract (HONEYWELL INTERNATIONAL INC.)

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LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL

Organization Name

HONEYWELL INTERNATIONAL INC.

Inventor(s)

Yaqun Liu of Hangzhou (CN)

Yunyun Zhang of Zhangjiagang (CN)

LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18523255 titled 'LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL

Simplified Explanation:

The patent application describes a thermal interface material that includes a low melting point gallium alloy, a mercapto group-containing silicone oil, an emulsifying compound, at least one polymer, a thermally conductive powder, and a coupling compound.

Key Features and Innovation:

  • Combination of low melting point gallium alloy and mercapto group-containing silicone oil for thermal interface material.
  • Inclusion of emulsifying compound to stabilize the mixture.
  • Use of thermally conductive powder to enhance heat transfer.
  • Incorporation of coupling compound to improve adhesion to surfaces.

Potential Applications: The technology can be used in electronic devices, automotive applications, aerospace industry, and other heat transfer applications.

Problems Solved: The material addresses the need for efficient heat dissipation in various electronic and mechanical systems.

Benefits:

  • Improved thermal conductivity.
  • Enhanced heat dissipation.
  • Better adhesion to surfaces.
  • Increased efficiency in cooling systems.

Commercial Applications: Potential commercial uses include thermal management solutions for electronics, automotive cooling systems, and industrial heat transfer applications.

Questions about the Technology: 1. How does the combination of gallium alloy and silicone oil improve thermal conductivity? 2. What are the specific advantages of using an emulsifying compound in the thermal interface material?

Frequently Updated Research: Stay updated on advancements in thermal interface materials, heat transfer technologies, and applications in various industries.


Original Abstract Submitted

A thermal interface material including at least a low melting point gallium alloy and a mercapto group-containing silicone oil, as well as an emulsifying compound, at least one polymer, a thermally conductive powder, and a coupling compound.