18523234. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Soonku Kwon of Suwon-si (KR)

Sunggil Kang of Suwon-si (KR)

Chanyeong Jeong of Suwon-si (KR)

Jeongmin Bang of Suwon-si (KR)

Yeongkwang Lee of Suwon-si (KR)

Ilgon Choi of Suwon-si (KR)

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18523234 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The patent application describes a substrate processing apparatus with a chamber, a substrate support, a plasma source, an ion blocker, and a temperature controller.

  • The chamber has two spaces, with the substrate support in the first space and the plasma source in the second space.
  • The ion blocker, located between the two spaces, allows radicals from the plasma to pass through to the substrate.
  • The temperature controller includes heaters and chillers to control the ion blocker's temperature.
  • The ion blocker is divided into regions, each with a heating line and boundary regions.

Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production

Problems Solved: - Ensures efficient delivery of radicals to the substrate - Controls temperature for optimal processing conditions

Benefits: - Improved substrate processing efficiency - Enhanced control over plasma radicals delivery - Consistent and reliable results in thin film deposition

Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance thin film deposition processes, leading to higher quality and more reliable semiconductor products. The market implications include increased production efficiency and improved product performance.

Questions about the technology: 1. How does the ion blocker enhance the substrate processing efficiency? The ion blocker allows radicals from the plasma to reach the substrate, ensuring effective processing. 2. What are the benefits of dividing the ion blocker into regions? Dividing the ion blocker into regions with heating lines and boundary regions allows for precise temperature control and efficient delivery of radicals to the substrate.


Original Abstract Submitted

A substrate processing apparatus includes a chamber including a first space and a second space, a substrate support in the first space and configured to support a substrate, a plasma source configured to generate plasma in the second space, an ion blocker between the second space and the first space, the ion blocker including through-holes configured to pass therethrough radicals of the plasma from the second space to the first space and provide the radicals to the substrate, and a temperature controller including a plurality of heaters connected to the ion blocker, one or more chillers, and a controller configured to control output of the plurality of heaters and output of the one or more chillers, where the ion blocker includes a plurality of regions, each of the plurality of regions including a heating line, one or more boundary regions.