18523172. METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING simplified abstract (ASM IP Holding B.V.)
Contents
- 1 METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING
Organization Name
Inventor(s)
Jithin Prabha of Tempe AZ (US)
Joseph Kraus of Brandon FL (US)
Pawan Rao of Cupertino CA (US)
METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523172 titled 'METHOD, SYSTEM AND APPARATUS FOR SUBSTRATE HANDLING AND COOLING
Simplified Explanation
The substrate cooling apparatus described in the patent application includes a cooling plate with embedded substrate support members, a channel for coolant flow, and a thermally conductive material in the channel. Open recesses on the cooling plate are designed to receive substrate handling members of an indexer.
- Cooling plate with embedded substrate support members
- Channel for coolant flow with a thermally conductive material
- Open recesses on the cooling plate for substrate handling members
Potential Applications
The technology described in this patent application could be applied in industries such as semiconductor manufacturing, electronics assembly, and materials processing where precise substrate cooling is required.
Problems Solved
This technology solves the problem of efficiently cooling substrates during manufacturing processes, ensuring consistent and controlled temperatures for optimal performance.
Benefits
The benefits of this technology include improved substrate cooling efficiency, enhanced process control, and potentially higher yields in manufacturing processes.
Potential Commercial Applications
The potential commercial applications of this technology could include semiconductor fabrication equipment, electronic device manufacturing machinery, and industrial cooling systems.
Possible Prior Art
One possible prior art for this technology could be cooling plates with embedded channels for coolant flow, but the specific design with embedded substrate support members and open recesses for substrate handling members may be unique to this patent application.
Unanswered Questions
How does this technology compare to traditional substrate cooling methods?
This technology offers a more precise and controlled cooling solution compared to traditional methods, potentially leading to improved manufacturing outcomes and product quality.
What are the potential cost implications of implementing this technology in industrial processes?
The cost implications of implementing this technology may vary depending on the scale of production and specific requirements of the manufacturing process. Further cost-benefit analysis would be needed to determine the overall impact on operations.
Original Abstract Submitted
A substrate cooling apparatus includes a cooling plate with a top surface including an array of embedded substrate support members protruding therefrom. A channel is disposed in an underside portion of the cooling plate, the conduit is embedded in the channel, a conduit comprising a coolant inlet at a first end and a coolant outlet at a second end, and a viscous thermally conductive material is disposed in the channel and is thermally coupled to an interior surface of the channel and an exterior surface of the conduit. One or more open recesses are disposed in a top surface of the cooling plate extending inward from a perimeter of the cooling plate toward a center point of the cooling plate, the open recesses disposed circumferentially on diametrically opposite sides of the cooling plate wherein the open recesses are sized to receive a corresponding substrate handling member of an indexer. Substrate transfer systems, cooling plate arrangements, and substrate transfer methods are also described.
