18523007. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE simplified abstract (STMicroelectronics International N.V.)
Contents
- 1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Mauro Mazzola of Calvenzano (BERGAMO) (IT)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18523007 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a method of arranging a semiconductor die on an electrically conductive substrate using an electrically conductive clip for electrical coupling.
- Electrically conductive clip bridges semiconductor die and conductive lead
- Clip has proximal portion to contact lead and distal portion with sculpturing to engage openings
- Simplifies assembly process and ensures secure electrical connection
Potential Applications
The technology can be applied in various electronic devices such as smartphones, computers, and automotive electronics where semiconductor dies need to be securely mounted and electrically connected.
Problems Solved
This technology solves the problem of ensuring reliable electrical coupling between a semiconductor die and an electrically conductive substrate, while also simplifying the assembly process.
Benefits
- Secure electrical connection - Simplified assembly process - Improved reliability of electronic devices
Potential Commercial Applications
The technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment to improve the efficiency and reliability of electronic systems.
Possible Prior Art
One possible prior art could be the use of soldering or wire bonding techniques to connect semiconductor dies to electrically conductive substrates. However, the use of an electrically conductive clip as described in the patent application provides a unique and potentially more efficient solution.
Unanswered Questions
How does the electrically conductive clip compare to traditional soldering methods in terms of cost and efficiency?
The article does not provide a direct comparison between the electrically conductive clip and traditional soldering methods in terms of cost and efficiency. It would be beneficial to understand the cost implications and efficiency gains of adopting this new technology over traditional methods.
What are the potential challenges or limitations of implementing this technology in high-volume manufacturing processes?
The article does not address the potential challenges or limitations of implementing this technology in high-volume manufacturing processes. It would be important to consider factors such as scalability, compatibility with existing manufacturing equipment, and potential impact on production timelines.
Original Abstract Submitted
A semiconductor die is arranged at a die mounting location of an electrically conductive substrate. The electrically conductive substrate includes an array of electrically conductive leads having openings at the periphery of the electrically conductive substrate. An electrically conductive clip is arranged in a bridge-like position between the semiconductor die and an electrically conductive lead in the array of electrically conductive leads to provide electrical coupling therebetween. The electrically conductive clip has an end coupled to the electrically conductive lead, wherein the end includes: a planar proximal portion configured to contact the electrically conductive lead proximally of the openings, and a distal portion projecting beyond the proximal portion distally thereof, the distal portion provided with sculpturing configured to engage the openings to facilitate immobilizing the electrically conductive clip in the bridge-like position between the semiconductor chip and electrically conductive lead.
