18522909. SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD simplified abstract (STMicroelectronics International N.V.)
Contents
- 1 SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Francesca De Viti of Milano (IT)
Damian Halicki of Agrate Brianza (IT)
Giovanni Graziosi of Vimercate (IT)
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522909 titled 'SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
Simplified Explanation
The abstract describes an integrated circuit semiconductor dice with electrically conductive patterns and an electrical component bridging between the surfaces of the semiconductor die.
- The semiconductor dice has first and second opposed surfaces.
- Electrically conductive patterns on the surfaces provide electrical coupling to the semiconductor die.
- An electrical component, such as a capacitor, extends bridge-like between the surfaces.
- Opposed electrical contact end terminals of the electrical component are coupled to the electrically conductive patterns.
- The electrical component is electrically coupled to the semiconductor die via the conductive patterns.
Potential Applications
This technology could be applied in the manufacturing of integrated circuits, particularly in compact designs where space is limited.
Problems Solved
This innovation solves the problem of efficiently integrating electrical components into semiconductor dice, allowing for more compact and streamlined designs.
Benefits
The benefits of this technology include improved electrical coupling, space-saving design, and potentially enhanced performance of integrated circuits.
Potential Commercial Applications
- "Innovative Integration of Electrical Components in Semiconductor Dice for Enhanced Performance"
Possible Prior Art
There may be prior art related to the integration of electrical components in semiconductor dice, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology impact the overall size of integrated circuits?
This technology could potentially reduce the overall size of integrated circuits, but the extent of the size reduction is not specified in the abstract.
What types of electrical components can be integrated using this method?
The abstract mentions capacitors as an example, but it is unclear if other types of electrical components can also be integrated using this method.
Original Abstract Submitted
An integrated circuit semiconductor dice has first and second opposed surfaces. First and second electrically conductive patterns extending at the first and second opposed surfaces provide electrical coupling to the semiconductor die. An electrical component, such as a capacitor, having a length transverse to the first and second opposed surfaces of the semiconductor die, extends bridge-like between the first and second opposed surfaces. Opposed electrical contact end terminals of the electrical component are coupled to the first and second electrically conductive patterns. The electrical component is thus electrically coupled to the semiconductor die via the first and second electrically conductive patterns at the first and second opposed surfaces.
