18522825. PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Taichi Monden of Yamanashi (JP)
Atsushi Tanaka of Yamanashi (JP)
PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522825 titled 'PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
Simplified Explanation: The patent application describes a method for pre-coating a substrate processing apparatus before depositing material on a substrate.
- Supply a fluorine-containing gas to clean the processing chamber.
- Introduce a reducing gas to purge the chamber.
- Add raw material and reducing gases to form a pre-coat film.
- Purge the chamber again before depositing material on the substrate.
Key Features and Innovation:
- Use of fluorine-containing gas for cleaning.
- Sequential introduction of gases for pre-coating.
- Purging steps to ensure cleanliness before substrate deposition.
Potential Applications: This method can be used in semiconductor manufacturing, thin film deposition, and other industries requiring precise material deposition processes.
Problems Solved: The method addresses the challenge of maintaining a clean processing environment for consistent and reliable substrate coating.
Benefits:
- Improved substrate coating quality.
- Enhanced process reliability.
- Reduced contamination risks.
Commercial Applications: This technology can be applied in semiconductor fabrication facilities, research laboratories, and industrial settings requiring controlled material deposition processes.
Prior Art: Readers can explore prior patents related to substrate processing methods, gas introduction techniques, and thin film deposition processes.
Frequently Updated Research: Stay informed about advancements in substrate processing technologies, gas purification methods, and material deposition techniques for potential improvements in the pre-coating process.
Questions about Precoat Method: 1. How does the use of a fluorine-containing gas improve the cleaning process in the substrate processing chamber? 2. What are the potential variations in the types of raw material gases that can be used in this pre-coating method?
Original Abstract Submitted
A precoat method for a substrate processing apparatus for depositing on a substrate using a raw material gas and a reducing gas is provided. The method includes: a) supplying a fluorine-containing gas into a processing chamber to clean an inside of the processing chamber; b) after a), supplying a reducing gas into the processing chamber to purge the inside of the processing chamber; c) after b), supplying a raw material gas and a reducing gas into the processing chamber to form a precoat film; and d) after c), supplying a reducing gas into the processing chamber to purge the inside of the processing chamber before depositing on a subsequent substrate.
