18522481. WAFER, AND LIQUID EJECTION CHIP simplified abstract (CANON KABUSHIKI KAISHA)
Contents
WAFER, AND LIQUID EJECTION CHIP
Organization Name
Inventor(s)
RYOTARO Murakami of Kanagawa (JP)
MANABU Otsuka of Kanagawa (JP)
WAFER, AND LIQUID EJECTION CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522481 titled 'WAFER, AND LIQUID EJECTION CHIP
Simplified Explanation: The patent application describes a wafer and a liquid ejection chip designed to prevent a decrease in yield by including an adhesive agent accumulation portion that prevents adhesive agent accumulation in a gap between two substrates.
Key Features and Innovation:
- Adhesive agent accumulation portion prevents adhesive agent buildup in the gap between substrates.
- Helps maintain yield by preventing issues caused by adhesive agent accumulation.
- Ensures the adhesive agent stays away from the bottom of a groove, enhancing the functionality of the wafer and liquid ejection chip.
Potential Applications: The technology can be applied in the manufacturing of wafers and liquid ejection chips in various industries such as semiconductor, printing, and medical devices.
Problems Solved: The technology addresses the problem of decreased yield caused by adhesive agent accumulation in the gap between substrates, which can lead to malfunctions and reduced product quality.
Benefits:
- Improved yield in wafer and liquid ejection chip manufacturing processes.
- Enhanced product quality and reliability.
- Prevention of malfunctions due to adhesive agent accumulation.
Commercial Applications: The technology can be utilized in semiconductor fabrication facilities, printing companies, and medical device manufacturers to improve production efficiency and product quality.
Prior Art: Readers can explore prior patents related to wafer manufacturing, liquid ejection chips, and adhesive agent control in microfabrication processes to gain a deeper understanding of the technology.
Frequently Updated Research: Stay informed about the latest advancements in wafer manufacturing, liquid ejection chip technology, and adhesive agent control in microfabrication processes to enhance your knowledge of the field.
Questions about the Technology: 1. What are the potential implications of this technology in the semiconductor industry? 2. How does the adhesive agent accumulation portion contribute to preventing yield decrease in wafer manufacturing?
Original Abstract Submitted
An object is to provide a wafer, and a liquid ejection chip which are capable of preventing a decrease in yield. To that end, an adhesive agent accumulation portion is provided at which an adhesive agent coming out of a gap between a first channel substrate and a second channel substrate accumulates and stays away from a bottom of a groove.
