18522468. DISPLAY DEVICE simplified abstract (Japan Display Inc.)

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DISPLAY DEVICE

Organization Name

Japan Display Inc.

Inventor(s)

Tenfu Nakamura of Tokyo (JP)

DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18522468 titled 'DISPLAY DEVICE

Simplified Explanation

The patent application describes a display device with a light guide that includes two transparent substrates of different thicknesses bonded together.

  • The display device includes a display panel, a light guide, and a light source.
  • The light guide overlaps with the display panel and includes a first side surface where the light emitted by the light source enters.
  • The light guide is made up of a first transparent substrate, a second transparent substrate, and a first adhesive layer bonding the two substrates together.
  • The thickness of the second transparent substrate is different from the thickness of the first transparent substrate.

Potential Applications

This technology could be applied in:

  • LCD displays
  • LED screens
  • Digital signage

Problems Solved

This technology helps in:

  • Improving light distribution in display devices
  • Enhancing image quality
  • Increasing energy efficiency

Benefits

The benefits of this technology include:

  • Better brightness and contrast in displays
  • Thinner and lighter display devices
  • Reduced power consumption

Potential Commercial Applications

Commercial applications for this technology may include:

  • Smartphones
  • Tablets
  • Monitors

Possible Prior Art

One possible prior art for this technology could be the use of light guides in display devices with different substrate thicknesses to improve light distribution and image quality.

Unanswered Questions

How does the different thickness of the transparent substrates affect the overall performance of the display device?

The different thicknesses of the transparent substrates may impact factors such as light transmission, image clarity, and overall display quality.

What manufacturing processes are involved in bonding the two transparent substrates together?

The bonding process of the two transparent substrates may involve techniques such as adhesive application, curing, and quality control measures to ensure a strong and durable bond.


Original Abstract Submitted

According to one embodiment, a display device includes a display panel displaying an image, a light guide overlapping with the display panel and including a first side surface, and a light source emitting light to the first side surface. The light guide includes a first transparent substrate, a second transparent substrate provided between the display panel and the first transparent substrate, and a first adhesive layer bonding the first transparent substrate to the second transparent substrate. A thickness of the second transparent substrate is different from a thickness of the first transparent substrate.