18522225. CHIP ON FILM PACKAGE simplified abstract (Samsung Display Co., LTD.)
Contents
CHIP ON FILM PACKAGE
Organization Name
Inventor(s)
CHIP ON FILM PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18522225 titled 'CHIP ON FILM PACKAGE
The abstract describes a chip on film package that includes a base substrate with a driving chip area, output lines, and an adhesive member.
- Base substrate with driving chip area and output lines
- Driving chip area with first and second sides
- First areas covering ends of the first side with first bent portions
- Driving chip and output lines on first surface of base substrate
- Adhesive member overlapping first areas and driving chip area
Potential Applications: - Consumer electronics - Automotive industry - Medical devices
Problems Solved: - Efficient packaging of driving chips - Secure electrical connections - Space-saving design
Benefits: - Improved reliability - Enhanced performance - Cost-effective manufacturing
Commercial Applications: Title: Innovative Chip on Film Package for Enhanced Electronics This technology can be used in various industries such as consumer electronics, automotive, and medical devices, offering improved reliability and performance.
Questions about Chip on Film Package: 1. How does the adhesive member contribute to the overall design of the package? The adhesive member provides secure attachment and protection for the driving chip and output lines, ensuring reliability in various applications.
2. What are the advantages of having output lines electrically connected on the first surface of the base substrate? Having output lines connected on the first surface allows for efficient routing and connection to external components, enhancing the overall functionality of the package.
Original Abstract Submitted
A chip on film package includes a base substrate including a driving chip area including a first side and a second side facing the first side, first areas covering ends of the first side of the driving chip area and including first bent portions, and a second area covering the second side of the driving chip area, a driving chip disposed on a first surface of the base substrate in the driving chip area, output lines electrically connected to the driving chip and disposed on the first surface of the base substrate in the first areas and the second area, and an adhesive member disposed on the base substrate and overlapping an entirety of the first areas and an entirety of the driving chip area in a plan view.
