18521264. APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
Contents
APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Shigeru Sugioka of Higashihiroshima (JP)
APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521264 titled 'APPARATUS INCLUDING AIR GAP IN SCRIBE REGION OF SEMICONDUCTOR DEVICE
The patent application describes an apparatus with an insulating structure in the scribe region, multiple metal layers including a top metal layer within the insulating structure in the scribe region, a groove on top of the insulating structure in the scribe region, and an air gap between the top metal layer and the groove.
- The apparatus includes an insulating structure in the scribe region.
- It has multiple metal layers, including a top metal layer within the insulating structure in the scribe region.
- There is a groove on top of the insulating structure in the scribe region.
- An air gap exists between the top metal layer and the groove in the scribe region.
Potential Applications: - This technology could be used in semiconductor manufacturing processes. - It may find applications in the production of electronic devices. - The apparatus could be utilized in the development of advanced integrated circuits.
Problems Solved: - Provides improved insulation in the scribe region. - Enhances the performance and reliability of electronic components. - Facilitates the manufacturing of complex semiconductor devices.
Benefits: - Increased efficiency in semiconductor fabrication. - Enhanced durability and longevity of electronic products. - Enables the creation of more sophisticated integrated circuits.
Commercial Applications: Title: Advanced Semiconductor Manufacturing Apparatus This technology could revolutionize the semiconductor industry by improving the efficiency and reliability of manufacturing processes. It has the potential to impact various sectors, including electronics, telecommunications, and computing.
Questions about the technology: 1. How does the presence of an air gap between the top metal layer and the groove benefit the apparatus? 2. What specific advantages does the insulating structure in the scribe region offer in semiconductor manufacturing?
Original Abstract Submitted
According to one or more embodiments, an apparatus includes an insulating structure in the scribe region, a plurality of metal layers, the metal layers including a top metal layer in the insulating structure in the scribe region, a groove on a top of the insulating structure in the scribe region, and an air gap between the top metal layer and the groove in the scribe region.
