18520733. ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
- 1 ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
Tetsuya Nakanishi of Osaka (JP)
ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520733 titled 'ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE
Simplified Explanation
The electric-wire-equipped connection member described in the patent application consists of an electric wire with a center conductor, an insulating layer, and a shield layer made of metal, as well as an insulating substrate with a through hole for the electric wire to pass through. The center conductor is exposed on one surface of the insulating substrate, and a metal plating layer is present on the inner surface of the through hole and at least one of the surfaces of the substrate. The shield layer is electrically connected to the metal plating layer.
- Electric wire with center conductor, insulating layer, and metal shield layer
- Insulating substrate with through hole for wire insertion
- Metal plating layer on inner surface of through hole and substrate surface
- Shield layer electrically connected to metal plating layer
Potential Applications
The technology described in this patent application could be applied in various industries such as telecommunications, electronics manufacturing, and automotive for creating reliable and secure electrical connections.
Problems Solved
This technology solves the problem of ensuring proper electrical connections while also providing insulation and protection for the wires, reducing the risk of interference or damage.
Benefits
The benefits of this technology include improved electrical conductivity, enhanced durability, and increased safety in electrical connections.
Potential Commercial Applications
The potential commercial applications of this technology include manufacturing of high-quality cables, connectors, and electronic devices with improved performance and reliability.
Possible Prior Art
One possible prior art for this technology could be similar patents related to electric wire connections and insulating substrates with metal plating layers for enhanced conductivity and protection.
Unanswered Questions
How does this technology compare to existing wire connection methods in terms of cost-effectiveness and efficiency?
This article does not provide specific information on the cost-effectiveness and efficiency of this technology compared to existing wire connection methods. Further research or comparative studies would be needed to address this question.
What are the potential environmental impacts of using this technology in terms of materials used and disposal processes?
The article does not discuss the environmental impacts of using this technology. An analysis of the materials used, their sustainability, and the disposal processes required would be necessary to answer this question.
Original Abstract Submitted
An electric-wire-equipped connection member includes: an electric wire including a center conductor, an insulating layer covering the center conductor, and a shield layer made of metal and covering the insulating layer; and an insulating substrate including a first surface and a second surface and having a through hole which has openings in the first surface and the second surface and in which a portion of the electric wire where the shield layer is exposed is inserted. The center conductor is exposed from the first surface of the insulating substrate. The insulating substrate includes a metal plating layer formed continuously on an inner peripheral surface of the through hole and at least one of the first surface and the second surface. The shield layer is electrically connected to the metal plating layer.
