18520453. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
Organization Name
Inventor(s)
Kyounglim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520453 titled 'SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
The semiconductor package described in the patent application consists of a lower redistribution structure, a semiconductor device placed on it, a lower encapsulant surrounding the semiconductor device, and an upper composite redistribution structure on the upper part of the semiconductor device.
- The lower redistribution structure provides a foundation for the semiconductor device.
- The lower encapsulant protects the side surface of the semiconductor device.
- The upper composite redistribution structure includes primary and secondary conductive structures, connection vias, and an upper encapsulant.
- The connection vias facilitate communication between the primary and secondary conductive structures.
- The upper encapsulant safeguards the connection vias and enhances the structural integrity of the package.
Potential Applications: - This technology can be used in various electronic devices requiring reliable semiconductor packaging. - It can be applied in industries such as telecommunications, automotive, and consumer electronics.
Problems Solved: - Ensures secure and efficient communication within the semiconductor package. - Enhances the durability and protection of the semiconductor device.
Benefits: - Improved reliability and performance of electronic devices. - Enhanced structural integrity and protection of semiconductor components.
Commercial Applications: Title: "Advanced Semiconductor Packaging Technology for Enhanced Device Reliability" This technology can be utilized in the production of high-performance electronic devices, catering to a wide range of industries and markets.
Prior Art: No prior art information is provided in the abstract.
Frequently Updated Research: There is no information on frequently updated research related to this technology at the moment.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology compare to traditional packaging methods? 2. What are the potential cost implications of implementing this advanced packaging technology in electronic devices?
Original Abstract Submitted
A semiconductor package includes a lower redistribution structure. A semiconductor device is disposed on the lower redistribution structure. A lower encapsulant is disposed on the lower redistribution structure and surrounds a side surface of the semiconductor device. An upper composite redistribution structure is disposed on an upper portion of the semiconductor device and includes a primary conductive structure, a secondary conductive structure disposed on the primary conductive structure, connection vias disposed between the primary conductive structure and the secondary conductive structure, and an upper encapsulant disposed between the primary conductive structure and the secondary conductive structure and surrounding the connection vias.
