18520405. CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE simplified abstract (Micron Technology, Inc.)
Contents
- 1 CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE
Organization Name
Inventor(s)
David P. Gooch of Meridian ID (US)
CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520405 titled 'CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE
Simplified Explanation
The patent application describes methods, systems, and devices for chip select wiring for a dual device package. Here is a simplified explanation of the patent application:
- Circuit board with multiple layers including first outer layer, second inner layer, and third outer layer
- First and second chip select (CS) signal lines routed through the second inner layer
- First and second memory devices coupled with the first and third outer layers
- First via coupling the first CS signal line with a first upper memory die and a second lower memory die
- Second via coupling the second CS signal line with a second upper memory die and a first lower memory die
Potential Applications
The technology can be applied in the development of advanced memory devices and circuit boards for improved performance and efficiency.
Problems Solved
The technology solves the problem of efficiently routing chip select signals in a dual device package, ensuring proper communication between memory devices and the circuit board.
Benefits
The benefits of this technology include enhanced signal integrity, reduced interference, and optimized performance of memory devices in a dual package configuration.
Potential Commercial Applications
The technology can be utilized in the manufacturing of high-performance computing systems, data centers, and other electronic devices requiring efficient chip select wiring for memory devices.
Possible Prior Art
One possible prior art could be the use of traditional chip select wiring methods in circuit boards and memory devices.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
The patent application does not provide information on the cost implications of implementing this technology in electronic device manufacturing processes.
What are the potential challenges in integrating this technology into existing memory device manufacturing processes?
The patent application does not address the potential challenges that may arise when integrating this technology into current memory device manufacturing processes.
Original Abstract Submitted
Methods, systems, and devices for chip select wiring for a dual device package are described. A circuit board includes a plurality of layers, the plurality of layers including a first outer layer, a second inner layer, and a third outer layer. The circuit board also includes first and second chip select (CS) signal lines routed through the second inner layer of the circuit board, first and second memory devices coupled with the first outer layer and the third outer layer, respectively, a first via coupling the first CS signal line with a first upper memory die of the first memory device and a second lower memory die of the second memory device, and a second via coupling the second CS signal line with a second upper memory die of the second memory device and a first lower memory die of the first memory device.
