18520093. METHODS FOR MAKING FLOW CELLS simplified abstract (ILLUMINA, INC.)
Contents
METHODS FOR MAKING FLOW CELLS
Organization Name
Inventor(s)
Jeffrey S. Fisher of San Diego CA (US)
Sahngki Hong of San Diego CA (US)
Lewis J. Kraft of San Diego CA (US)
David Prescott of San Diego CA (US)
Brandon Wenning of San Diego CA (US)
Weixian Xi of San Diego CA (US)
METHODS FOR MAKING FLOW CELLS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520093 titled 'METHODS FOR MAKING FLOW CELLS
The abstract describes a method where a positive photoresist is deposited over a substrate with depressions separated by interstitial regions. The photoresist is exposed to ultraviolet light at a non-perpendicular, non-parallel angle, and offset from the surface plane of the depressions. This process renders a portion of the photoresist in each depression insoluble while leaving another portion soluble. The soluble portions are removed, revealing a first substrate portion in each depression. A functionalized layer is then deposited over these portions. The insoluble portions are subsequently removed, exposing a second substrate portion in each depression, over which a second functionalized layer is selectively deposited.
- Positive photoresist deposited over substrate with depressions
- Exposed to ultraviolet light at non-perpendicular, non-parallel angle
- Soluble and insoluble portions of photoresist in each depression
- Removal of soluble portions reveals first substrate portion
- Deposition of first functionalized layer
- Removal of insoluble portions exposes second substrate portion
- Selective deposition of second functionalized layer
Potential Applications: - Microelectronics manufacturing - Microfluidics - Biomedical devices
Problems Solved: - Precise patterning of functionalized layers - Selective deposition in microscale features
Benefits: - Enhanced control over surface functionalization - Improved device performance and reliability
Commercial Applications: Title: Advanced Microfabrication Technology for Precision Functionalization This technology can be used in the production of microelectronic devices, lab-on-a-chip systems, and medical diagnostic tools. It offers a high level of precision in functionalizing microscale features, leading to improved product performance and reliability.
Prior Art: Researchers can explore prior art related to microfabrication techniques, photoresist processing, and surface functionalization methods to understand the evolution of this technology.
Frequently Updated Research: Researchers in the field of microfabrication and surface engineering are constantly developing new methods and materials for enhancing the precision and efficiency of functionalization processes. Stay updated on the latest advancements in this area to leverage cutting-edge technologies for your applications.
Questions about Advanced Microfabrication Technology for Precision Functionalization:
1. How does this technology improve the precision of functionalization processes? This technology enhances precision by selectively depositing functionalized layers on specific substrate portions within microscale features, ensuring accurate and reliable surface modification.
2. What are the potential applications of this technology beyond microelectronics manufacturing? This technology can also be applied in fields such as microfluidics, biomedical devices, and sensor development, where precise surface functionalization is crucial for device performance and functionality.
Original Abstract Submitted
In an example method, a positive photoresist is deposited over a substrate that includes depressions separated by interstitial regions. The positive photoresist is exposed to ultraviolet light at an angle that is non-perpendicular, non-parallel, and offset from a surface plane of the depressions such that a first portion of the positive photoresist in each depression remains soluble and a second portion of the positive photoresist in each depression is rendered insoluble. The soluble portions of the positive photoresist are removed, which exposes a first substrate portion in each depression. A first functionalized layer is deposited over the first substrate portion in each depression. The insoluble portions of the positive photoresist are removed, which exposes a second substrate portion in each depression. The second functionalized layer is selectively deposited over the second substrate portion in each depression.
