18520047. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Sangjine Park of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520047 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The substrate processing apparatus described in the patent application includes a processing container, a substrate support, a fluid supplier, a shower head assembly, laser portions for measuring alignment, and a controller for position correction.
- The processing container contains the processing space where the substrate is placed.
- The fluid supplier provides a supercritical processing fluid to the processing space.
- The shower head assembly diffuses the processing fluid over the substrate.
- The first laser portion measures horizontal alignment, while the second laser portion measures vertical alignment.
- The controller corrects the position of the substrate, shower head assembly, or processing container based on the measured alignments.
Potential Applications
The technology described in the patent application could be applied in industries such as semiconductor manufacturing, thin film deposition, and surface modification processes.
Problems Solved
This technology solves the problem of precise alignment between the processing container, shower head assembly, and substrate, ensuring uniform processing and high-quality results.
Benefits
The benefits of this technology include improved processing accuracy, enhanced product quality, increased efficiency, and reduced material waste.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices, where precise substrate processing is crucial for device performance.
Possible Prior Art
Prior art in this field may include similar substrate processing apparatus with alignment measurement and correction systems, but the specific configuration and use of laser portions within the processing container could be a novel aspect of this innovation.
Unanswered Questions
How does the controller determine the extent of position correction needed based on the measured alignments?
The controller likely uses algorithms to analyze the measured horizontal and vertical alignments and calculates the necessary adjustments to ensure proper alignment between the substrate, shower head assembly, and processing container.
Safety measures such as laser shielding, interlocks, and proper training for personnel may be implemented to ensure the safe operation of the laser portions within the processing container.
Original Abstract Submitted
Provided is a substrate processing apparatus including a processing container having a processing space, a substrate support configured to support a substrate, a fluid supplier configured to supply a processing fluid in a supercritical state to the processing space, a shower head assembly configured to diffuse the processing fluid, a first laser portion configured to measure a horizontal alignment between the processing container and the shower head assembly, a second laser portion configured to measure a vertical alignment between the processing container and the shower head assembly, and a controller configured to correct the position of one of the substrate, the shower head assembly, and the processing container, based on the measured horizontal and vertical alignments, wherein the first and second laser portions are configured to be positioned within the processing container and to move above the substrate.
