18518393. SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)

SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS

Organization Name

ASM IP Holding B.V.

Inventor(s)

Fan Gao of Chandler AZ (US)

Peipei Gao of Chandler AZ (US)

Xing Lin of Chandler AZ (US)

Arun Murali of Tempe AZ (US)

Gregory Deye of Seattle WA (US)

Frederick Aryeetey of Phoenix AZ (US)

Amir Kajbafvala of Chandler AZ (US)

Caleb Miskin of Mesa AZ (US)

Alexandros Demos of Scottsdale AZ (US)

SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18518393 titled 'SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS

Simplified Explanation

The patent application describes systems and methods for controlling the pressure differential between two sealed chambers connected by a gate valve in preparation for a gate valve opening event. This involves adjusting gas pressure in at least one of the chambers until the pressure differential between the two chambers reaches a predetermined level.

• The innovation involves a system that can adjust gas pressure in chambers connected by a gate valve to ensure a specific pressure differential before the valve is opened.
• The technology is designed to facilitate the transfer of substrates between chambers, such as from a reaction chamber to a substrate handling chamber, by maintaining the desired pressure conditions.

Potential Applications

The technology could be applied in semiconductor manufacturing processes, where precise control of pressure differentials is crucial for transferring substrates between processing chambers.

Problems Solved

This technology solves the problem of maintaining optimal pressure differentials between chambers to ensure the safe and efficient transfer of substrates without contamination or damage.

Benefits

The benefits of this technology include improved process efficiency, reduced risk of substrate damage, and enhanced overall system reliability in semiconductor manufacturing operations.

Potential Commercial Applications

The technology could find commercial applications in the semiconductor industry for the development of advanced manufacturing systems that require precise pressure control for substrate handling processes.

Possible Prior Art

One possible prior art could be systems that control pressure differentials in vacuum chambers for various manufacturing processes, but specific applications related to gate valve opening events for substrate transfer may not have been addressed in prior patents.

How does this technology impact the overall efficiency of semiconductor manufacturing processes?

This technology can significantly improve the efficiency of semiconductor manufacturing processes by ensuring smooth and controlled substrate transfers between chambers, reducing downtime and enhancing overall productivity.

What are the potential cost savings associated with implementing this pressure control system in semiconductor manufacturing facilities?

Implementing this pressure control system can lead to cost savings by minimizing substrate damage, reducing maintenance requirements, and optimizing process parameters, ultimately improving the overall yield and profitability of semiconductor manufacturing operations.

Original Abstract Submitted

Systems and methods controlling the pressure differential between two sealed chambers connected by a gate valve in preparation for a gate valve opening event. Such systems and methods may adjust gas pressure in at least one of the chambers, if needed, until the pressure differential between the two chambers is at a predetermined pressure differential level. In some more specific examples, one chamber may constitute a substrate handling chamber, the other chamber may constitute a reaction chamber (e.g., for depositing one or more layers on a surface of a substrate), and the gate valve opening event may allow a substrate to be transferred from one chamber to the other (e.g., from the reaction chamber into the substrate handling chamber).