18517942. MEMORY CARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
MEMORY CARD
Organization Name
Inventor(s)
Youngwoo Park of Suwon-si (KR)
MEMORY CARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517942 titled 'MEMORY CARD
The abstract of the patent application describes a memory card with a case containing an integrated circuit package and a marking layer exposed through a through-hole in the case.
- The memory card includes a case with a first and second case portion coupled together.
- An integrated circuit package is located within the case to store data.
- A marking layer is present in the case and is visible through a through-hole in the second case portion.
- The through-hole allows for the marking layer to be exposed to the outside environment.
- This design allows for easy identification and customization of the memory card.
Potential Applications: - Memory cards for electronic devices - Data storage devices in various industries - Customizable promotional memory cards
Problems Solved: - Easy identification of memory cards - Customization options for branding or personalization
Benefits: - Enhanced visual appeal - Easy customization for different purposes - Improved user experience
Commercial Applications: Title: Customizable Memory Cards for Enhanced Branding This technology can be used in the production of memory cards for promotional purposes, allowing companies to customize the appearance of the cards with their branding.
Questions about the technology: 1. How does the through-hole in the second case portion benefit the memory card design?
The through-hole allows for the marking layer to be visible from the outside, enabling easy identification and customization.
2. What are the potential advantages of having a marking layer in the memory card case?
The marking layer allows for branding, personalization, and easy identification of the memory card.
Original Abstract Submitted
A memory card includes a case including a first case portion and a second case portion that is coupled to the first case portion, an integrated circuit package located in the case, and a marking layer located in the case, wherein the second case portion includes a through-hole, wherein the marking layer is exposed to an outside through the through-hole.
